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About this event
IC Packaging Fair (ICPF) — Event Overview
The IC Packaging Fair (ICPF) is a specialized semiconductor packaging and testing exhibition focused on bringing together domestic packaging and testing service providers (OSAT), integrated device manufacturers (IDM in-house teams), and leading electronics manufacturing service partners. The event is designed as a “one-stop solutions” platform across the semiconductor packaging and testing process, helping industry participants build new customer relationships and deepen cooperation throughout the packaging and testing ecosystem.
Event Dates
October 27 – 29, 2026
Venue & Location
Shenzhen World Exhibition & Convention Center (Baoan), Shenzhen, China
What the Show Covers (Semiconductor Packaging & Testing)
ICPF concentrates on advanced equipment, materials, and solutions used in semiconductor packaging and testing. It addresses core packaging and testing needs for multiple semiconductor categories, including:
- Integrated Circuits (ICs) & advanced packaging
- Power devices (including power semiconductor packaging and testing)
- Optoelectronic semiconductors (packaging and testing solutions)
- Sensors (packaging and testing processes)
Exhibition Scale & Business Value
The event positions itself as a high-intent industry marketplace by connecting upstream and downstream resources across the semiconductor packaging and testing chain. Through buyer-focused programming, it supports exhibitors in:
- efficiently developing new customers
- exploring new business areas
- promoting in-depth cooperation within the packaging and testing industry
Exhibit Categories (Key Equipment & Solutions)
1) Core Equipment for Integrated Circuits & Advanced Packaging & Testing
- Die bonder, chip bonder, glass bonding machine, flip chip bonder
- Wire bonder, molding machine, etching machine
- Optical cutting machine, lithography machine, vacuum coating machine
- PVD sputtering machine
2) Core Equipment for Power Semiconductor Packaging & Testing
- Die bonder, chip bonder
- Methane flow furnace, sintering furnace
- Wire bonder, wedge bonder, dispensing equipment
- Molding machine, ball bonder
- Ultrasonic scanner, etc.
3) Core Equipment for Optoelectronic Semiconductor Packaging & Testing
- Die bonder, chip bonder, ball bonder
- Underfill dispense machine, automatic capping machine
- LD chip high-low temperature tester
- TO testing equipment, COC testing equipment, etc.
4) Peripheral & Testing Equipment & Materials
- Wafer thinning machine
- AOI inspection equipment
- Functional tester, electroplating equipment
- Push-pull tester
- Silver paste
- Heat-sink, ceramic substrate
- Aluminum wire / copper wire / gold wire
- Etching solution, cleaning agent, photoresist
Target Audience (Who to Expect)
The event’s target audience is clearly defined around semiconductor packaging and testing operational ownership. Attendees are expected to come from:
- OSAT (engineering and manufacturing departments)
- IDM in-house packaging workshop (engineering and manufacturing departments)
- IDM (R&D / design departments)
Show Highlights & Engagement Format
ICPF includes industry-focused content and structured commercial interaction to strengthen buyer–exhibitor engagement, including:
- Equipment & Materials Showcase
- International Semiconductor Packaging Technology Forum
- Semiconductor packaging and testing process demonstration
- Monthly & thematic business matching sessions
- Semiconductor Packaging and Testing Processes Demonstration Zone including: Integrated Circuits & Advanced Packaging workshop displays, IGBT & SiC module packaging demonstration line, and 800G/1.6T optical module packaging demonstration line.
Concurrent Events (Conference Tracks)
In addition to the exhibition, ICPF features conference programming covering advanced packaging technology and application areas, including:
- SiP and Advanced Semiconductor Packaging Technology Conference
- Power Semiconductor Technology and Applications Conference
- Optoelectronic Devices Packaging and Testing Technology Conference
Why This Event Matters for Semiconductor Packaging & Testing Buyers
ICPF is positioned for companies and teams that need advanced packaging and testing equipment, materials, and process solutions. With a clear OSAT/IDM/R&D–manufacturing audience focus and industry demonstrations for real packaging and testing lines, the event is structured to support practical evaluation, vendor learning, and business matching between relevant stakeholders.
Data sheet
IC Packaging Fair – Event Attendee & Buyer Profile Analysis
Event Date: October 27–29, 2026
Location: Shenzhen World Exhibition & Convention Center (Baoan), Shenzhen, China
Event Status: Upcoming
Research Date: July 1, 2026
Event Overview
| Event Name | IC Packaging Fair (ICPF) |
| Event Date | October 27–29, 2026 |
| Event Status | Upcoming |
| Venue | Shenzhen World Exhibition & Convention Center (Baoan) |
| City | Shenzhen |
| State / Region | Guangdong |
| Country | China |
| Organizer | RX Global / NEPCON ASIA |
| Official Event Website | nepconasia.com/en-gb/bandaoti/ic-pack.html |
| Event Type | Trade show, exhibition, industry conference, business matchmaking event |
| Primary Category | Electric & Electronics |
| Secondary Applicable Categories | Industrial Engineering, IT & Technology, Science & Research |
| Audience Reach | National with international participation potential |
| Estimated Attendance / Expected Footfall | Attendance figure not publicly confirmed by the organizer. Official website states 3,000+ buyers for the ICPF platform and 77,000+ visitors for the broader NEPCON ASIA show ecosystem. |
| Attendance Data Reliability | Medium to High for broader show statistics; Medium for ICPF-specific buyer volume because the official page references “3,000+ buyers” but does not separately publish a fully verified current-year attendee list. |
| Main Purpose of Event | To connect semiconductor packaging and testing equipment/material suppliers with OSATs, IDM packaging operations, R&D teams, and related manufacturing buyers through exhibition, forums, process demonstrations, and business matchmaking. |
About the Event
IC Packaging Fair (ICPF) is a semiconductor packaging and testing-focused event held within the NEPCON ASIA ecosystem in Shenzhen. The official event content positions it as a business platform for advanced equipment, materials, and process solutions spanning integrated circuits, power semiconductors, optoelectronics, and sensor-related packaging and testing workflows.
The event matters because it concentrates technical buyers and solution providers around a highly specialized manufacturing value chain. For suppliers, ICPF is relevant for lead generation, channel development, and account targeting across OSATs, IDM manufacturing and R&D teams, electronics manufacturing service providers, and companies investing in advanced packaging, process automation, inspection, and materials innovation.
1. Who Attends: Buyers / Attendees
| Buyer / Attendee Segment | Typical Organizations | Buying Role or Influence | Relevance to Exhibitors / Suppliers |
|---|---|---|---|
| OSAT engineering and manufacturing teams | Outsourced semiconductor assembly and test providers | Evaluate equipment, materials, throughput, yield, and process cost | Core buyer group for packaging tools, inspection systems, and consumables |
| IDM packaging operations teams | Integrated device manufacturers with in-house packaging | Influence CapEx, process upgrades, and supplier qualification | Important for advanced packaging, test, and automation vendors |
| IDM R&D and design departments | Chip design, package design, and process engineering teams | Define technical requirements and pilot new technologies | High value for materials, design enablement, and testing innovations |
| EMS and electronics manufacturing leaders | Electronics manufacturing service providers | Select process tools and production technologies | Relevant for production line equipment, testing, and materials suppliers |
| Procurement and sourcing teams | Semiconductor manufacturers, packaging plants, and EMS firms | Source capital equipment, consumables, and service contracts | Strong fit for supplier qualification and RFQ-based outreach |
| Process engineering and yield improvement teams | Packaging fabs, OSATs, device manufacturers | Assess performance, reliability, and defect reduction | Ideal for metrology, inspection, bonding, and process control vendors |
| Manufacturing operations leaders | Factories, production plants, and packaging lines | Drive throughput, utilization, and automation decisions | Relevant for line automation, maintenance, and integration services |
| Technical buyers and product managers | Equipment OEMs, materials firms, semiconductor companies | Translate market needs into product specs and sourcing priorities | Useful for new product launches and technical selling |
| Industry consultants and analysts | Engineering consultants, market analysts, technical advisors | Influence vendor evaluation and ecosystem visibility | Useful for awareness and partnership development |
| Association and ecosystem leaders | Industry associations, innovation hubs, regional manufacturing groups | Shape industry relationships and referrals | Useful for partnerships, sponsorship, and co-marketing |
2. Event Location and Attendee Geographic Origin
| Geographic Area | Likely Attendee Origin | Buyer Concentration | Notes |
|---|---|---|---|
| Shenzhen host city | Local semiconductor, electronics, and manufacturing firms | High | Shenzhen is a major electronics manufacturing and supply chain hub |
| Guangdong Province | Regional buyers from Dongguan, Guangzhou, Huizhou, Foshan, Zhongshan, Zhuhai | High | Dense electronics and industrial manufacturing base supports strong regional attendance |
| Greater China | Buyers from mainland China, Hong Kong, Macau, and Taiwan | High | Semiconductor packaging and electronics supply chains are spread across Greater China |
| National China reach | OSATs, IDMs, EMS firms, equipment distributors, and materials buyers from major Chinese industrial provinces | Medium to High | Likely draw from Jiangsu, Zhejiang, Shanghai, Beijing-Tianjin, and other manufacturing corridors |
| International reach | Regional APAC buyers, suppliers, and technical delegates | Medium | Official website references international buyers and 3,000+ international visitors across the broader show ecosystem |
| Global semiconductor ecosystem | Suppliers, technology partners, and trade visitors from semiconductor markets worldwide | Medium | Mainly relevant for specialist vendors, channel partners, and business development teams |
3. Audience Reach
| Reach Level | Assessment | Explanation |
|---|---|---|
| National | Primary classification | The event is hosted in a major Chinese electronics manufacturing center and is designed to attract buyers from across China. |
| Secondary reach: Regional APAC | Supporting classification | The show ecosystem includes international visitors and industry stakeholders from neighboring Asian markets. |
4. Sample Buyer Companies and Websites
| Buyer Company / Organization | Buyer Type | Why It Is Relevant | Website | Best Job Titles to Target | Evidence Level |
|---|---|---|---|---|---|
| ASE Technology Holding Co., Ltd. | OSAT / semiconductor packaging | Large outsourced assembly and test operator; strong fit for packaging tools and materials | aseglobal.com | Procurement Director, Packaging Engineering Manager, Process Engineering Manager | Strong Market Fit, Attendance Not Confirmed |
| JCET Group | OSAT / advanced packaging | China-based packaging and testing leader with direct relevance to ICPF | jcetglobal.com | VP Operations, Head of Packaging, Strategic Sourcing Manager | Strong Market Fit, Attendance Not Confirmed |
| Tongfu Microelectronics Co., Ltd. | OSAT / test and packaging | Packaging and testing buyer with demand for equipment, consumables, and process upgrades | tongfu.com.cn | Procurement Manager, Engineering Director, Manufacturing Director | Strong Market Fit, Attendance Not Confirmed |
| Huatian Technology Co., Ltd. | Semiconductor packaging and testing | Well aligned with advanced packaging, substrate, and testing workflows | huatechgroup.com | Operations Director, Test Engineering Manager, Procurement Lead | Strong Market Fit, Attendance Not Confirmed |
| Will Semiconductor Co., Ltd. Shanghai | IDM / semiconductor design and manufacturing | Relevant for packaging R&D, test engineering, and supplier sourcing | willsemi.com | R&D Director, Packaging Technology Lead, Sourcing Manager | Strong Market Fit, Attendance Not Confirmed |
| SMIC | IDM / foundry ecosystem | Advanced packaging and process integration are relevant to foundry operations | smics.com | Process Integration Director, Equipment Engineering Manager, Procurement Director | Strong Market Fit, Attendance Not Confirmed |
| NXP Semiconductors | IDM / semiconductor manufacturer | Automotive, industrial, and power semiconductor packaging needs align with the show | nxp.com | Packaging Engineering Manager, Category Manager, Supply Chain Director | Strong Market Fit, Attendance Not Confirmed |
| Infineon Technologies | Power semiconductor manufacturer | Power device packaging and reliability testing are major fit areas | infineon.com | Power Packaging Lead, Test Engineering Director, Strategic Sourcing Manager | Strong Market Fit, Attendance Not Confirmed |
| Amkor Technology | OSAT | Global packaging and test provider with clear event relevance | amkor.com | VP Packaging, Procurement Lead, Process Engineering Manager | Strong Market Fit, Attendance Not Confirmed |
| Tianshui Huatian Technology | Semiconductor packaging and testing | Relevant buyer for equipment, test, and materials suppliers | huatechgroup.com | Operations Director, Purchasing Manager, Packaging Engineering Director | Strong Market Fit, Attendance Not Confirmed |
| Dingjing Technology / advanced packaging ecosystem suppliers | Semiconductor manufacturing ecosystem | Potential buyers of advanced packaging, inspection, and automation solutions | dingjing.com | Engineering Director, Product Director, Supply Chain Manager | Strong Market Fit, Attendance Not Confirmed |
5. Job Profiles, Industries and Event Type
| Priority | Job Title / Function | Department | Seniority Level | Why This Role Matters |
|---|---|---|---|---|
| 1 | Chief Procurement Officer / VP Procurement | Procurement | C-level / VP | Owns sourcing strategy, vendor approval, and spend allocation for major equipment and materials |
| 2 | Director of Procurement / Strategic Sourcing Manager | Procurement / Supply Chain | Director / Manager | Evaluates suppliers, drives RFQs, and manages long-term sourcing |
| 3 | Packaging Engineering Manager / Head of Packaging | Engineering / Manufacturing | Manager / Director | Defines tool requirements and qualification criteria for packaging lines |
| 4 | Process Engineering Director / Manager | Process Engineering | Director / Manager | Evaluates yield, reliability, throughput, and process improvement solutions |
| 5 | R&D Director / Design Manager | R&D / Product Development | Director / Manager | Influences technology adoption and advanced packaging roadmaps |
| 6 | Manufacturing Director / Operations Director | Operations | Director | Responsible for factory throughput, automation, and capital investment decisions |
| 7 | Test Engineering Manager | Test / Quality | Manager | Important for test equipment, reliability validation, and inspection vendors |
| 8 | Category Manager / Buyer | Procurement | Manager / Senior Manager | Handles supplier comparisons, quotes, and purchasing decisions |
| 9 | Supplier Quality / Quality Director | Quality / Supply Chain | Manager / Director | Validates supplier quality and process compliance |
| 10 | Business Development Director / Partnerships Director | Commercial / Partnerships | Director | Useful for OEMs, distributors, and channel partners seeking market access |
| Priority | Apollo Industry | Why It Fits the Event | Best Buyer Use Case |
|---|---|---|---|
| 1 | Electrical/Electronic Manufacturing | Core manufacturing base for semiconductor packaging equipment and materials buyers | OEMs, EMS firms, and production technology buyers |
| 2 | Semiconductors | Directly aligned with packaging and testing use cases | OSATs, IDMs, foundries, and chip manufacturers |
| 3 | Computer Hardware | Hardware supply chains depend on advanced packaged ICs | Device manufacturers and hardware integrators |
| 4 | Industrial Automation | Automation is central to packaging line optimization | Machine OEMs, integration partners, smart factory buyers |
| 5 | Mechanical or Industrial Engineering | Relevant to precision equipment, tooling, and process systems | Engineering buyers and technical evaluators |
| 6 | Machinery | Packaging and testing equipment suppliers and buyers sit in this category | Capital equipment sourcing and industrial sales |
| 7 | Computer & Network Security | Useful for digital factory systems, IP protection, and secure manufacturing environments | Operational technology and plant security buyers |
| 8 | Information Technology & Services | Supports smart factory, MES, analytics, and data-driven operations | IT leaders and digital transformation teams |
| 9 | Import & Export | Distributors and trading firms help move tools and materials into the market | Channel partners and regional suppliers |
| 10 | Logistics & Supply Chain | Critical for semiconductor materials flow and factory continuity | Supply chain directors and inventory planners |
| 11 | Packaging & Containers | Relevant for chip carriers, trays, and packaging materials workflows | Materials and consumables suppliers |
| 12 | Research | Innovation, process development, and technical validation are central themes | R&D labs and applied research institutions |
6. Estimated Attendance
| Metric | Figure | Status | Source / Basis | Notes |
|---|---|---|---|---|
| Estimated total footfall | Not publicly confirmed for ICPF alone | Confirmed unavailable | Official page does not publish a standalone current-year attendance total for ICPF | Attendance figure not publicly confirmed by the organizer. |
| Buyer count | 3,000+ buyers | Confirmed on official website | ICPF official meta description | Presented as buyer reach for the ICPF platform |
| Broader visitor scale | 77,000+ visitors | Confirmed on official website | NEPCON ASIA official show statistics | Broader ecosystem statistic, not ICPF-only footfall |
| Exhibitor count | 600+ exhibitors | Confirmed on official website | NEPCON ASIA official show statistics | Broader ecosystem statistic |
| International visitors | 3,000+ international visitors | Confirmed on official website | NEPCON ASIA official show statistics | Broader ecosystem statistic |
| Speaker count | Not publicly confirmed | Unavailable | Official content lists forums/conferences but not a current verified count | Use as qualitative evidence only |
7. Key Focus Areas and Buyer Engagement
| Focus Area | Typical Buyer Need | Buyer Engagement Opportunity | Relevant Supplier Offering |
|---|---|---|---|
| Advanced packaging | Higher density, smaller form factors, better performance | Demo new process capability and package innovation | Bonding, encapsulation, assembly, substrates, design services |
| Inspection and testing | Reliability, defect detection, throughput improvement | Show accuracy, speed, and quality-control outcomes | AOI, testers, metrology, inspection software |
| Power semiconductor packaging | Thermal management, reliability, and ruggedization | Target SiC/IGBT packaging decision-makers | Sintering furnaces, die attach, thermal materials |
| Optoelectronic packaging | Precision assembly and high-performance testing | Engage with module makers and test specialists | Alignment systems, test rigs, capping, bonding equipment |
| Materials and consumables | Stable supply of wires, pastes, substrates, cleaners | RFQ-driven supplier meetings and qualification discussions | Wire, paste, photoresist, cleaning agent, ceramic substrate |
| Factory automation | Higher efficiency, lower labor dependency, better traceability | Book meetings with operations and process improvement teams | Automation lines, robotics, MES, data capture tools |
Lead Quality Assessment
| Factor | Assessment | Explanation |
|---|---|---|
| Buyer relevance | Very High | The event is built around direct purchasing and technical evaluation of packaging and testing solutions. |
| Decision-maker availability | High | Likely to attract procurement, engineering, operations, and R&D leaders from OSATs and IDMs. |
| Data collection potential | Medium to High | Official site provides buyer-facing content, forums, matchmaking, and visitor programs, but not a full public attendee list. |
| Apollo targeting potential | Very High | Clear alignment to semiconductor, electronics manufacturing, machinery, and supply chain job functions. |
| Geographic targeting potential | High | Strong China, Greater China, and APAC relevance with Shenzhen as a supply chain hub. |
| Best outreach approach | High-touch account-based outreach | Target engineering, procurement, and operations stakeholders with technical value messaging and meeting requests. |
| Overall lead quality | Very High | Strong event fit for B2B attendee list building and high-intent buyer targeting in semiconductor packaging. |
| Best use case | Lead generation and account targeting | Useful for exhibitors, attendee list sales, sponsorship sales, and follow-up outreach campaigns. |
| Limitations / risks | Moderate | Public current-year named attendee lists are not fully disclosed; confirmed current-year company-level attendance is limited. |
Apollo.io Targeting Recommendation
| Filter Type | Recommended Filters | Purpose |
|---|---|---|
| Apollo industries | Semiconductors, Electrical/Electronic Manufacturing, Machinery, Industrial Automation, Mechanical or Industrial Engineering, Information Technology & Services | Identify the most relevant technical and manufacturing buyers |
| Departments | Procurement, Engineering, Operations, R&D, Manufacturing, Supply Chain, Quality | Focus on functional buyers and decision makers |
| Seniority | Manager, Senior Manager, Director, VP, CXO | Prioritize higher-conversion contacts with budget or influence |
| Job titles | Procurement Director, Strategic Sourcing Manager, Packaging Engineering Manager, Process Engineering Director, Manufacturing Director, Operations Director, Test Engineering Manager, R&D Director, Category Manager, Buyer | Capture likely buyers and influencers for packaging, testing, and materials solutions |
| Geography | China, Guangdong, Shenzhen, Greater China, APAC | Align outreach with event geography and supply chain density |
| Employee size | 201–500, 501–1,000, 1,001–5,000, 5,001–10,000, 10,000+ | Prioritize industrial firms, fabs, and large OSAT/IDM organizations |
| Keywords | semiconductor packaging, advanced packaging, OSAT, IDM, chip packaging, wire bonder, die bonder, testing, inspection, AOI, SiC, IGBT, optoelectronic packaging | Surface high-intent accounts with clear technical relevance |
| Technologies | MES, factory automation, industrial inspection, manufacturing analytics, EDA-related workflows where relevant | Useful for digital transformation and automation vendors |
| Company type | Manufacturer, OEM, OSAT, IDM, EMS, distributor, engineering services firm | Match the core buyer ecosystem around the show |
Suggested Apollo Search Logic: (semiconductors OR electrical/electronic manufacturing OR machinery OR industrial automation) AND (procurement OR sourcing OR packaging engineering OR process engineering OR operations OR manufacturing OR R&D OR quality) AND (director OR manager OR VP OR head OR buyer OR category manager) AND (China OR Guangdong OR Shenzhen OR Greater China)
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Sources & Verification Notes
| Source | Type | What It Verified | Reliability |
|---|---|---|---|
| IC Packaging Fair official page | Official organizer website | Event name, dates, venue, buyer profile, ICPF focus, show highlights, target audience, and buyer-oriented positioning | High |
| NEPCON ASIA official homepage | Official event ecosystem page | Broader show statistics including 77,000+ visitors, 600+ exhibitors, and 3,000+ international visitors | High |
| Venue & Travel page | Official organizer website | Venue and city confirmation for Shenzhen World Exhibition & Convention Center (Baoan), Shenzhen, China | High |
| Shenzhen World Exhibition & Convention Center official website | Venue website | Venue identity and geographic verification | High |
| Visit / Buyers / TAP / Business Matchmaking pages | Official organizer website | Buyer program, matchmaking orientation, and attendee targeting relevance | High |
🎯 Selling to this event's audience? Get a free tailored buyer list
Tell us your work email and our AI instantly builds a buyer list matched to IC Packaging Fair — the best‑fit companies to target, the exact decision‑maker job titles, and the industry filters that fit what you sell.
🔒 Get my buyer details Free · ~20 seconds