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UID:event-5494@360eventhub.com
DTSTAMP:20260721T105703Z
DTSTART;VALUE=DATE:20261027
DTEND;VALUE=DATE:20261030
SUMMARY:IC Packaging Fair
DESCRIPTION:IC Packaging Fair (ICPF) — Event Overview The IC Packaging 
 Fair (ICPF) is a specialized semiconductor packaging and testing exhibit
 ion focused on bringing together domestic packaging and testing service 
 providers (OSAT)\, integrated device manufacturers (IDM in-house teams)\
 , and leading electronics manufacturing service partners. The event is d
 esigned as a “one-stop solutions” platform across the semiconductor 
 packaging and testing process\, helping industry participants build new 
 customer relationships and deepen cooperation throughout the packaging a
 nd testing ecosystem. Event Dates October 27…\n\nhttps://360eventhub.c
 om/event.php?slug=ic-packaging-fair
LOCATION:Shenzhen World Exhibition & Convention Center\, Shenzhen\, China
URL:https://360eventhub.com/event.php?slug=ic-packaging-fair
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