2026 The 11th International Conference on Integrated Circuits and Microsystems (ICICM 2026)
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About this event
2026 The 11th International Conference on Integrated Circuits and Microsystems (ICICM 2026)
Date: October 16–18, 2026
Venue: Xi'an Jiaotong University, Xi'an, China
Event Type: Academic & Industry Conference, Research Symposium, Technical Exhibition
Estimated Attendance: 500–800 attendees (researchers, engineers, academicians, industry professionals)
1️⃣ Who Attends (Buyers / Attendees)
ICICM 2026 attracts a specialized audience of:
- Research scientists and engineers in integrated circuits (ICs) and microsystems
- University professors and academic researchers
- IC design and manufacturing professionals
- R&D managers from semiconductor and electronics companies
- Government and institutional funders of technology research
- PhD students and postdoctoral researchers
- Industry partners seeking academic collaborations
2️⃣ Location + Attendee Geographic Origin
Event Location: Xi'an Jiaotong University, Xi'an, China
Attendee Origin: Primarily China (80%+), with international participation from:
- United States (semiconductor researchers)
- Japan and South Korea (electronics manufacturing)
- Europe (academic institutions)
- India (emerging IC design hubs)
3️⃣ Audience Reach
Reach Type: Global (with strong local Chinese foundation)
ICICM is positioned as an international platform but maintains deep roots in China's academic and industrial IC development ecosystem. The conference bridges domestic Chinese innovation with global semiconductor advancements.
4️⃣ Sample Buyer Company Names + Websites
| Priority | Company | Website | Best Title to Target | Why This is a Good Buyer Fit |
|---|---|---|---|---|
| 1 | SMIC (Semiconductor Manufacturing International Corporation) | www.smics.com | Director of R&D, IC Technology Manager | China's largest foundry; actively invests in advanced IC manufacturing research |
| 2 | Intel China | www.intel.com | Principal Research Scientist, Chiplet Architect | Focus on advanced packaging and 3D integration (Track 3) |
| 3 | Huawei HiSilicon | www.hisi.com | IC Design Manager, RF/Microwave Engineer | Leading Chinese IC design house with 5G/6G focus (Track 4) |
| 4 | TSMC (Taiwan Semiconductor Manufacturing Company) | www.tsmc.com | Senior Process Development Engineer | Global leader in advanced IC fabrication technologies |
| 5 | Keysight Technologies China | www.keysight.com | Technical Marketing Manager, RF/Microwave | Test and measurement solutions for RF/THz ICs (Track 4) |
| 6 | China Academy of Electronics Technology (CAET) | www.caet.cn | Chief Engineer, Microsystem Researcher | Government-backed R&D institution for national IC strategy |
| 7 | Arm China | www.arm.com | RISC-V Ecosystem Manager, AI Acceleration Architect | Relevant to Track 2 (RISC-V) and Track 1 (AI accelerators) |
| 8 | Advanced Micro Devices (AMD) China | www.amd.com | Senior Chip Architect, Neuromorphic Computing Researcher | Interest in AI accelerators (Track 1) and 3D packaging (Track 3) |
| 9 | National University of Defense Technology (NUDT) | www.nudt.edu.cn | Professor of Microelectronics, Defense IC Program Manager | Key Chinese institution for military and high-reliability microsystems |
| 10 | Siemens Electronic Industries Software (China) | www.siemens.com | ECD Director, EDA Tool Sales Manager | Electronic Design Automation (EDA) tools for IC development |
Top 5 Best Samples to Send Client First: SMIC, Intel China, Huawei HiSilicon, TSMC, China Academy of Electronics Technology
5️⃣ Job Profiles, Industries & Event Type
Best Job Profiles to Target:
- Professor/Researcher in Microelectronics
- IC Design Engineer (Frontend/Back-end)
- R&D Manager, Semiconductor Manufacturing
- Technical Director, EDA Tools
- Business Development Manager, IC Equipment
- Government Technology Policy Advisor
- Biotechnology (for bio-sensors in Track 5)
- Computer Hardware
- Electrical/Electronic Manufacturing
- Information Technology & Services
- Research
- Defense & Space (for military microsystems)
- Higher Education
6️⃣ Estimated Attendance
Based on historical growth and venue capacity:
- Total Expected: 500–800 attendees
- Academic Researchers: 50%
- Industry Professionals: 35%
- Government/Institutional: 10%
- Students: 5%
7️⃣ Key Focus Areas & Buyer Engagement
Key Technical Tracks:
- AI Accelerators & Neuromorphic Computing (Track 1)
- RISC-V Architecture (Track 2)
- Chiplet & 3D Packaging (Track 3)
- 6G RF/Microwave ICs (Track 4)
- Sensor Technologies (Track 5)
- MEMS & Smart Microsystems (Track 6)
- Collaboration opportunities with academic institutions
- Exhibition of advanced IC manufacturing equipment
- Recruitment of PhD-level talent
- Partnerships for national technology initiatives
8️⃣ Client-Product Fit Note
Please share your client's website to refine targeting. For example:
- If client sells EDA tools: Prioritize Track 2 (RISC-V) and Track 3 (Packaging) attendees
- If client provides IC testing equipment: Focus on Track 4 (RF/Microwave) and Track 6 (MEMS)
- If client is an academic institution: Target university representatives and government funders
- If client is in semiconductor manufacturing: Highlight Track 3 and industry exhibitors
9️⃣ Final Recommendation
Quality Rating for B2B Engagement: 8.5/10
Strong technical focus with high buyer quality in R&D segments. Best suited for:
- Academic institutions seeking collaborations
- Semiconductor manufacturers and equipment providers
- Government technology initiative coordinators
- Advanced research tool vendors
Data sheet
2026 The 11th International Conference on Integrated Circuits and Microsystems (ICICM 2026) – Event Attendee & Buyer Profile Analysis
Event date: October 16–18, 2026
Location: Xi'an Jiaotong University, Xi'an, China
Event status: Upcoming
Research date: June 29, 2026
Event Overview
| Event Name | 2026 The 11th International Conference on Integrated Circuits and Microsystems (ICICM 2026) |
| Event Date | October 16–18, 2026 |
| Event Status | Upcoming |
| Venue | Xi'an Jiaotong University |
| City | Xi'an |
| State / Region | Shaanxi |
| Country | China |
| Organizer | Hosted by Xi'an Jiaotong University; co-sponsored by Xi'an Jiaotong University, Southeast University, and University of Electronic Science and Technology of China |
| Official Event Website | icicm.net |
| Event Type | Academic & Industry Conference; Research Symposium; Technical Presentation Event |
| Primary Category | Electric & Electronics |
| Secondary Applicable Categories | IT & Technology; Science & Research |
| Audience Reach | Global, with strong China-based participation |
| Estimated Attendance / Expected Footfall | Attendance figure not publicly confirmed by the organizer. |
| Attendance Data Reliability | Confirmed event existence, date, city, host, and conference scope from official website; attendance volume not publicly confirmed |
| Main Purpose of Event | To provide a platform for researchers, engineers, academicians, and industrial professionals to present research results, discuss integrated circuits and microsystems development, and establish research and business collaboration. |
About the Event
ICICM 2026 is the 11th edition of an annual international conference focused on integrated circuits, microsystems, advanced chip design, packaging, RF and THz ICs, AI accelerators, RISC-V architecture, sensors, and MEMS. According to the official event website, the conference will take place in Xi'an, China on October 16–18, 2026 and is hosted by Xi'an Jiaotong University with co-sponsorship from major Chinese engineering universities.
From a commercial intelligence perspective, this is primarily a high-value technical and research-driven event rather than a mass trade fair. It matters for semiconductor ecosystem outreach because it attracts academic labs, engineering researchers, industrial R&D professionals, and technology collaboration stakeholders involved in chip architecture, packaging, sensing, and microelectronics innovation. It is relevant for supplier prospecting in EDA tools, lab equipment, semiconductor materials, test and measurement, wafer and packaging technologies, university-industry collaboration, and research commercialization partnerships.
1. Who Attends: Buyers / Attendees
| Buyer / Attendee Segment | Typical Organizations | Buying Role or Influence | Relevance to Exhibitors / Suppliers |
|---|---|---|---|
| University research labs | Electrical engineering departments, microelectronics schools, key laboratories | Influence equipment selection, software usage, collaboration projects, and grant-funded purchases | High relevance for EDA, test equipment, sensors, prototyping tools, and research services |
| Semiconductor R&D engineers | IC design firms, packaging firms, device manufacturers, microsystems developers | Technical evaluators and specification influencers | Important for chip design tools, packaging materials, IP, RF components, and characterization systems |
| Professors and principal investigators | Universities, institutes, state labs | Shape collaborations, research agendas, publications, and funded consortium decisions | High value for strategic partnerships, sponsored research, and technical validation |
| Industrial professionals | Electronics manufacturers, advanced packaging teams, microsystem product developers | Apply technologies in production, pilot programs, and product roadmaps | Relevant for process technology, reliability testing, materials, instrumentation, and supply partnerships |
| Government and institutional research funders | Science foundations, public research programs, national labs | Funding influence rather than direct routine buying | Relevant for grant partnerships, consortium building, and technology program visibility |
| Postdoctoral researchers and PhD candidates | University and institute labs | Strong technical user influence; limited direct budget authority | Useful for product trials, software adoption, academic advocacy, and long-term pipeline building |
| Technology collaboration teams | University-industry alliance offices, joint labs, program leads | Partnership and commercialization influence | Important for pilot projects, licensing, research sponsorship, and ecosystem entry |
2. Event Location and Attendee Geographic Origin
| Geographic Area | Likely Attendee Origin | Buyer Concentration | Notes |
|---|---|---|---|
| Xi'an | Host-city researchers, local university labs, regional electronics ecosystem participants | High academic and engineering concentration | Host location supports strong local attendance from Xi'an Jiaotong University and nearby institutions |
| Shaanxi Province | Regional universities, research institutes, government-linked innovation entities | Medium to high | Likely feeder region for academic and public research attendance |
| Major China semiconductor hubs | Attendees from Beijing, Shanghai, Nanjing, Wuhan, Hefei, Chengdu, Shenzhen and other microelectronics centers | High | Supported by conference history across multiple leading Chinese tech cities |
| National China reach | Researchers, engineers, and industrial professionals from across China | Very high | Official site positions ICICM as an annual national-scale platform with international participation |
| International participation | Researchers and industrial specialists from global semiconductor and electronics communities | Selective but important | Official website states participation from researchers and industrial professionals from all over the world |
3. Audience Reach
| Reach Level | Assessment | Explanation |
|---|---|---|
| Global | Primary classification | The official website explicitly states the conference serves researchers, engineers, academicians, and industrial professionals from all over the world. |
| National | Strong secondary reach | Conference history across multiple Chinese cities and local co-sponsors indicate broad China-based participation. |
| Regional | Operational secondary layer | Xi'an and Shaanxi are likely to contribute meaningful host-region attendance, especially from academic and public research entities. |
4. Sample Buyer Companies and Websites
| Buyer Company / Organization | Buyer Type | Why It Is Relevant | Website | Best Job Titles to Target | Evidence Level |
|---|---|---|---|---|---|
| Xi'an Jiaotong University | Host university / research buyer | Host institution with direct relevance for microelectronics labs, sensor research, packaging research, and university procurement influence | xjtu.edu.cn | Professor, Lab Director, Dean, Procurement Officer, Research Program Manager | Confirmed Current-Year Participant |
| Southeast University | Co-sponsoring university / research buyer | Confirmed co-sponsor relevant to chip design, electronics, and collaborative research projects | seu.edu.cn | Professor, Department Chair, Research Center Director, Procurement Manager | Confirmed Current-Year Participant |
| University of Electronic Science and Technology of China | Co-sponsoring university / research buyer | Confirmed co-sponsor with strong relevance to microelectronics, RF, sensors, and semiconductor systems | uestc.edu.cn | Professor, Institute Director, Lab Manager, Research Procurement Lead | Confirmed Current-Year Participant |
| Journal of Electronics & Information Technology | Publication partner / research ecosystem organization | Selected papers are recommended to this journal, making it relevant for editorial, research network, and academic partnership outreach | jeit.ac.cn | Editor, Editorial Office Director, Research Collaboration Manager | Confirmed Speaker / Publication Organization |
| Aerospace Information Research Institute, Chinese Academy of Sciences (AIRCAS) | Research institute / institutional buyer | Named on the official page as host unit related to the recommended journal, relevant for advanced electronics, sensors, and systems research procurement | aircas.ac.cn | Institute Director, Principal Investigator, Research Equipment Manager | Confirmed Related Organization |
| Institute of Electronics, Chinese Academy of Sciences (IECAS) | Research institute / institutional buyer | Referenced in official publication information and relevant to integrated circuits, sensing, and microsystems research ecosystems | ie.cas.cn | Research Director, Lab Director, Procurement Officer, Program Manager | Confirmed Related Organization |
| Chinese Academy of Sciences | Public research system / institutional buyer | Mentioned in official journal description and highly relevant for semiconductor and electronics research procurement and partnerships | cas.cn | Research Institute Director, Procurement Lead, Program Director | Confirmed Related Organization |
| National Natural Science Foundation of China | Government research funding body | Referenced in official journal information and relevant for grant-aligned technology research ecosystems | nsfc.gov.cn | Program Officer, Research Funding Manager, Scientific Program Director | Confirmed Government / Procurement Organization |
| ICICM 2025 host ecosystem in Hefei | Historical participation evidence | Official website confirms ICICM 2025 was held in Hefei, indicating continuing presence of Chinese academic and semiconductor research communities | icicm.net | Conference Chair, University Lab Lead, Research Procurement Stakeholders | Historical / prior-year evidence |
| ICICM prior-edition host ecosystems in Nanjing, Shanghai, Beijing, Wuhan, Chengdu | Historical academic and research participant base | Official website history confirms sustained conference circulation across major China electronics and research hubs | icicm.net | Lab Directors, Professors, R&D Leads, Research Program Managers | Historical / prior-year evidence |
Note: The official website does not publish a current-year attendee directory. The table above prioritizes confirmed organizing, sponsoring, publication, and officially referenced ecosystem organizations. Historical entries are included as prior-year participation evidence and are not a confirmed attendee list for the current edition.
5. Job Profiles, Industries and Event Type
| Priority | Job Title / Function | Department | Seniority Level | Why This Role Matters |
|---|---|---|---|---|
| 1 | Professor / Principal Investigator | Research / Faculty | Senior | Leads research agenda, influences equipment purchases, and drives partnerships and publications |
| 2 | Lab Director | Research Operations | Director | Controls lab infrastructure decisions, vendor selection, and technical adoption |
| 3 | R&D Director | Research & Development | Director | Relevant in semiconductor companies evaluating design, packaging, and sensor technologies |
| 4 | IC Design Engineer | Engineering | Manager / Individual Contributor | Technical end user and evaluator for architecture, simulation, and prototyping solutions |
| 5 | Packaging Engineering Manager | Advanced Packaging / Manufacturing | Manager | Highly relevant due to conference tracks on chiplet and 2.5D/3D advanced packaging |
| 6 | Research Procurement Officer | Procurement | Manager | Handles institution-level acquisition of equipment, software, and services |
| 7 | Dean / Department Chair | Academic Leadership | Executive / Senior | Influences strategic collaborations, funding priorities, and large procurement projects |
| 8 | Program Manager | Research Programs / Partnerships | Manager | Useful for grant-backed projects, consortium management, and external supplier onboarding |
| 9 | Research Collaboration Manager | Partnerships | Manager / Director | Important for industry-university linkage and commercialization activity |
| 10 | Technology Transfer Director | Innovation / Commercialization | Director | Relevant where suppliers seek licensing, pilot deployments, or co-development agreements |
| Priority | Apollo Industry | Why It Fits the Event | Best Buyer Use Case |
|---|---|---|---|
| 1 | Semiconductors | Direct fit for integrated circuits, chip architecture, device design, and packaging topics | Chip design, foundry ecosystem, packaging, test, and IP-related outreach |
| 2 | Electrical/Electronic Manufacturing | Strong relevance to device development, electronics systems, and applied manufacturing | Equipment, materials, components, and testing solutions |
| 3 | Research | Fits public and private research institutes involved in microsystems and electronics innovation | Lab equipment, instrumentation, funded R&D partnerships |
| 4 | Higher Education | Universities are central participants, sponsors, hosts, and research buyers | Academic software, lab instruments, sponsored research, collaboration programs |
| 5 | Information Technology & Services | Relevant for design software, simulation tools, data infrastructure, and AI workflows | Design workflow tools, data platforms, compute services |
| 6 | Computer Hardware | Links to processor design, accelerators, and embedded device development | Processor architecture, chip integration, evaluation systems |
| 7 | Industrial Automation | Sensor and microsystems topics map well to industrial sensing and smart systems | MEMS, industrial sensing, embedded control applications |
| 8 | Nanotechnology | Advanced microsystems and device innovation often intersect with nanoscale engineering | Advanced materials, device characterization, microfabrication |
| 9 | Government Administration | Relevant for public research funders and institutional science bodies | Grant alignment, public technology programs, institutional partnerships |
| 10 | Mechanical or Industrial Engineering | Applies to packaging, microsystems integration, and fabrication process engineering | Packaging tools, process engineering, reliability and testing systems |
6. Estimated Attendance
| Metric | Figure | Status | Source / Basis | Notes |
|---|---|---|---|---|
| Estimated total footfall | Attendance figure not publicly confirmed by the organizer. | Unconfirmed | Official website reviewed | No official current-year attendee figure found in the provided organizer content |
| Exhibitor count | Not publicly confirmed | Unconfirmed | Official website reviewed | This appears to be conference-led rather than expo-led; exhibitor volume is not stated |
| Buyer count | Not publicly confirmed | Unconfirmed | Official website reviewed | No official buyer or delegate segmentation count published |
| Speaker count | Not publicly confirmed | Unconfirmed | Official website navigation indicates keynote speakers and committees pages | Speaker organizations exist but no consolidated count is present in the provided official text |
| Conference tracks publicly listed | 6 | Confirmed | Official website content | Tracks include AI accelerators, RISC-V, chiplet packaging, RF/THz ICs, sensors, and MEMS |
| Historical event continuity | 10 prior editions completed | Confirmed historical evidence | Official website history statement | Supports credibility and recurring market presence, but not a direct attendance figure |
7. Key Focus Areas and Buyer Engagement
| Focus Area | Typical Buyer Need | Buyer Engagement Opportunity | Relevant Supplier Offering |
|---|---|---|---|
| AI accelerators & neuromorphic computing | Advanced architecture design, simulation, validation, benchmarking | Technical workshops, design tool demos, co-research proposals | EDA, compute platforms, AI hardware design software, IP blocks |
| RISC-V processor chip design | Open architecture support, verification, embedded development | Developer ecosystem outreach and research partnerships | Processor IP, verification tools, dev boards, simulation environments |
| Chiplet technology & 2.5D/3D advanced packaging | Packaging process innovation, interconnect optimization, reliability testing | Packaging ecosystem selling and pilot project engagement | Packaging materials, test systems, thermal tools, interposer technologies |
| RF, microwave & THz ICs for 6G | High-frequency design, measurement, device characterization | Technical sales to RF labs and telecom-oriented chip teams | RF test equipment, simulation tools, materials, measurement systems |
| Sensor technologies | High-performance sensing, miniaturization, integration | Application-driven discussions and proof-of-concept programs | Sensor materials, MEMS fabrication support, embedded platforms |
| Smart microsystems & high-end MEMS sensors | Fabrication, packaging, integration, calibration, reliability | Partnerships with labs and engineering teams developing next-generation devices | MEMS design tools, fabrication services, packaging and characterization systems |
| Research collaboration & publication | Visibility, co-authorship, funded projects, ecosystem access | Relationship-led outreach rather than direct volume selling | Sponsored research, grants support, joint labs, commercialization services |
Lead Quality Assessment
| Factor | Assessment | Explanation |
|---|---|---|
| Buyer relevance | High | Strong fit for advanced semiconductor, lab, instrumentation, EDA, and research partnership suppliers; lower fit for general consumer or nontechnical offerings |
| Decision-maker availability | Medium | Attendees are likely to include technical influencers and senior academics, but final procurement may remain institutional or grant-dependent |
| Data collection potential | Medium | Useful for relationship mapping and ecosystem capture, but public attendee list visibility appears limited |
| Apollo targeting potential | High | Relevant industries and job functions can be targeted effectively in Apollo, especially university, research, and semiconductor roles |
| Geographic targeting potential | High | China is the strongest core market, with additional international semiconductor research reach |
| Best outreach approach | High | Use technical-value messaging, research collaboration language, and product application relevance instead of generic sales outreach |
| Overall lead quality | High | Specialized but high-value audience for precision B2B targeting in semiconductors and advanced research |
| Best use case | High | Ideal for account-based outreach, partnership development, target account enrichment, and research-oriented buyer profiling |
| Limitations / risks | Medium | Not a broad commercial expo; direct transactional buyers may be fewer than at large industry trade shows. Suitable for B2B attendee list building mainly in technical, academic, and R&D segments. |
Apollo.io Targeting Recommendation
| Filter Type | Recommended Filters | Purpose |
|---|---|---|
| Apollo industries | Semiconductors; Electrical/Electronic Manufacturing; Research; Higher Education; Information Technology & Services; Computer Hardware; Industrial Automation; Nanotechnology; Government Administration; Mechanical or Industrial Engineering | Capture both academic and industrial IC ecosystem targets |
| Departments | Engineering; Research; Procurement; Operations; Information Technology; Education; Program Management; Partnerships | Focus on users, influencers, and institutional decision-makers |
| Seniority | Director; VP; CXO; Head; Manager; Owner equivalent for labs and institutes; Senior | Prioritize budget holders and technical leaders |
| Job titles | Professor, Principal Investigator, Lab Director, R&D Director, IC Design Engineer, Packaging Engineering Manager, Research Procurement Officer, Department Chair, Dean, Program Manager, Research Collaboration Manager, Technology Transfer Director | Match actual likely conference personas |
| Geography | China first; Shaanxi, Beijing, Shanghai, Jiangsu, Hubei, Anhui, Sichuan, Guangdong; secondary global semiconductor hubs as needed | Align to event origin and strongest market concentration |
| Employee size | 51–200; 201–500; 501–1,000; 1,001–5,000; 5,001+ | Covers universities, institutes, and larger semiconductor organizations |
| Keywords | integrated circuits, microsystems, microelectronics, chiplet, RISC-V, advanced packaging, MEMS, sensors, RF IC, THz, 6G, neuromorphic, AI accelerator | Improves relevance where titles and industry labels are broad |
| Technologies | Use only if aligned to client offer: EDA, chip simulation, packaging, RF test, MEMS fabrication, lab instrumentation | Useful for narrowing technical account lists |
| Revenue range | Optional; use cautiously due to university and public institute presence | Better as a secondary refinement than a primary filter |
| Company type | Public research institute, university, semiconductor company, electronics manufacturer, government research body | Aligns database outputs to event reality |
Suggested Apollo Search Logic: (“integrated circuit” OR microelectronics OR microsystems OR chiplet OR “advanced packaging” OR MEMS OR sensor OR “RISC-V” OR “RF IC” OR “THz” OR “AI accelerator”) AND (Professor OR “Lab Director” OR “R&D Director” OR “Research Procurement” OR “Program Manager” OR “Packaging Engineer” OR “IC Design Engineer”) AND geography focused on China first.
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Sources & Verification Notes
| Source | Type | What It Verified | Reliability |
|---|---|---|---|
| ICICM 2026 Official Website | Official event website | Confirmed official event name, dates, Xi'an location, host and co-sponsors, conference purpose, prior-edition history, and track themes | High |
| ICICM 2026 Official Website – Proceedings / Submission Content | Official event website | Verified proceedings language, publication pathway, and related journal references | High |
| ICICM 2026 Official Website – Conference Tracks Content | Official event website | Verified focus areas including AI accelerators, RISC-V, chiplet packaging, RF/THz ICs, sensors, and MEMS | High |
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Tell us your work email and our AI instantly builds a buyer list matched to 2026 The 11th International Conference on Integrated Circuits and Microsystems (ICICM 2026) — the best‑fit companies to target, the exact decision‑maker job titles, and the industry filters that fit what you sell.
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