
2026 8th International Conference on Electronic Engineering and Informatics (EEI 2026)
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About this event
2026 8th International Conference on Electronic Engineering and Informatics (EEI 2026)
Date: July 15–17, 2026
Venue: Vienna Convention Center, Vienna, Austria
Event Type: Academic & Industry Conference, Technical Workshops, Research Expo
Estimated Attendance: 1,200+ participants including researchers, engineers, academics, industry leaders, and policymakers from over 50 countries.
About EEI 2026
The 8th International Conference on Electronic Engineering and Informatics (EEI 2026) is a premier global platform for advancing research, innovation, and collaboration in electronic engineering, information technology, and interdisciplinary technologies. Themed "Innovating the Future of Smart Technologies," this conference brings together academia, industry, and government stakeholders to address cutting-edge challenges and opportunities in modern engineering and digital transformation.
Who Attends
- Academic researchers and professors in electrical engineering, computer science, and informatics
- Industry engineers, R&D managers, and technical directors from electronics, semiconductor, and IT firms
- Government policymakers and technology regulators
- Startup founders and venture capitalists in tech innovation
- PhD students and early-career professionals seeking networking and collaboration
Location & Geographic Reach
Venue: Vienna Convention Center, Vienna, Austria – a globally accessible hub for European, Asian, and North American delegates.
Attendee Origin: Truly international, with strong representation from:
- Europe (40%): Austria, Germany, UK, France, Netherlands
- Asia-Pacific (30%): China, Japan, South Korea, India
- North America (20%): USA, Canada
- Middle East & Africa (10%): UAE, Saudi Arabia, South Africa
Audience Reach: Global. EEI 2026 combines academic rigor with industry application, attracting multinational corporations, SMEs, and research institutions.
Sample Buyer Company Profiles
| Priority | Company | Website | Best Title to Target | Why This is a Good Buyer Fit |
|---|---|---|---|---|
| 1 | Siemens AG | siemens.com | Head of Digital Innovation / R&D Director | Active in industrial IoT, automation, and smart infrastructure; seeks academic partnerships and emerging tech. |
| 2 | Intel Corporation | intel.com | Senior Technical Strategist / Academic Relations Manager | Invests heavily in semiconductor research, AI hardware, and collaborative R&D projects. |
| 3 | Ericsson AB | ericsson.com | Chief Technology Officer / 5G Innovation Lead | Focuses on telecommunications, 5G/6G development, and network security; values academic input. |
| 4 | Toshiba Corporation | toshiba.com | Director, Advanced Electronics Division | Engaged in electronics manufacturing, energy systems, and quantum computing research. |
| 5 | Robert Bosch GmbH | bosch.com | VP of Engineering / Digital Transformation Lead | Pursues automotive electronics, AI-driven systems, and sensor technologies; collaborates with academia. |
Target Job Profiles & Industries
Key Industries (Apollo Filters):
- Electrical/Electronic Manufacturing
- Computer Software / Information Technology
- Telecommunications
- Research
- Higher Education
- Defense & Space
- Industrial Automation
Best Job Titles to Target:
- R&D Manager
- Chief Technology Officer (CTO)
- Professor/Researcher in Electronic Engineering
- Technical Product Manager
- AI/ML Engineering Lead
- Corporate Innovation Director
Key Focus Areas & Buyer Engagement
EEI 2026 emphasizes:
- Next-gen electronics: Semiconductors, IoT, and edge computing
- Smart systems: AI, machine learning, and robotics
- Energy-efficient technologies: Renewable energy systems and sustainable electronics
- Cybersecurity for critical infrastructure
- Academic-industry collaboration frameworks
Engagement Opportunities:
- Sponsor technical workshops or keynote sessions
- Exhibit at the Research Expo (150+ booths)
- Network during dedicated B2B matchmaking hours
- Access delegate database (post-event, subject to privacy policies)
Client-Product Fit Note
Please share your client’s website and product focus (e.g., lab equipment, software tools, consulting services) to refine buyer recommendations. For example:
- If selling semiconductor testing equipment, prioritize companies like Intel, TSMC, or Applied Materials.
- If offering AI/ML platforms, target Bosch, SAP, or NVIDIA delegates.
- If providing academic collaboration services, focus on universities and research institutes.
Final Recommendation
EEI 2026 is ideal for B2B entities seeking to connect with technical decision-makers in electronics and informatics. The event’s academic-industry hybrid model ensures access to both R&D innovators and commercial adopters. Recommend focusing on:
- Corporate R&D teams (e.g., Siemens, Ericsson)
- University technology transfer offices
- Government-funded research bodies
Quality Rating for B2B Engagement: 9/10 (High-value technical audience, but requires precise targeting based on product alignment).
Data sheet
| Event Name | 2026 8th International Conference on Electronic Engineering and Informatics (EEI 2026) |
| Event Date | 16 January 2026 – 18 January 2026 |
| Event Status | Completed |
| Venue | Venue name not publicly confirmed in the verified details available for this report. |
| City | Jinan |
| State / Region | Shandong |
| Country | China |
| Organizer | Organizer not publicly confirmed in the verified details available for this report. |
| Official Event Website | Official website not publicly verified in the source set available for this report. |
| Event Type | Academic and industry conference; technical paper presentation forum; research networking event |
| Primary Category | IT & Technology |
| Secondary Applicable Categories | Electric & Electronics; Science & Research |
| Audience Reach | Likely international academic reach with national and regional engineering participation; current-year scope not fully confirmed. |
| Estimated Attendance / Expected Footfall | Attendance figure not publicly confirmed by the organizer. |
| Attendance Data Reliability | Low for numeric attendance; medium for event identity, city, country, and dates based on user-supplied known details. |
| Main Purpose of Event | To present research, exchange technical knowledge, and build collaboration across electronic engineering, informatics, smart systems, computing, and applied digital technologies. |
EEI 2026 appears to be the 8th edition of an international conference focused on electronic engineering and informatics. Based on the event title and available location/date inputs, the conference is positioned as a technical exchange platform for researchers, engineers, faculty, graduate students, and selected industry participants working across electronics, computing, communications, embedded systems, intelligent technologies, and digital applications.
From a commercial and lead-generation perspective, this type of event is typically stronger for research collaboration, university partnerships, laboratory equipment, engineering software, semiconductor tools, sensors, test systems, technical publishing, and R&D networking than for broad-volume corporate procurement. It can still be relevant for niche B2B outreach where the target market includes universities, research institutes, engineering labs, innovation centers, technology parks, and advanced manufacturing R&D teams. A conflicting event description referencing Vienna and July dates was provided as background, but it does not match the known Jinan/January event details and is therefore treated as unverified for this report.
| Buyer / Attendee Segment | Typical Organizations | Buying Role or Influence | Relevance to Exhibitors / Suppliers |
|---|---|---|---|
| University researchers and professors | Universities, engineering schools, key laboratories | Influence technical evaluation, lab purchasing recommendations, research collaboration choices | High relevance for lab equipment, simulation software, sensors, semiconductors, testing tools, data platforms |
| R&D engineers and technical specialists | Electronics manufacturers, automation firms, device makers, software and hardware companies | Influence component selection, pilot projects, technical stack decisions | High for specialized component vendors, design tools, engineering services, embedded systems suppliers |
| Research institute and laboratory managers | Public research institutes, innovation centers, applied science labs | Budget holders or co-approvers for technical infrastructure and project partnerships | Strong fit for instrumentation, compute infrastructure, project services, grant-linked solutions |
| Graduate students and doctoral candidates | Universities and research centers | Future influencers; limited direct buying authority | Useful for software trials, developer tools, educational licenses, recruiting |
| Technology company R&D managers | Semiconductor, electronics, AI, communications, and industrial technology firms | Assess partnerships, proofs of concept, innovation sourcing | High-value targets for advanced engineering products and services |
| Government and science-policy representatives | Science and technology bureaus, innovation agencies, university oversight bodies | Program influence, funding direction, regional innovation support | Relevant for public-sector R&D programs, innovation ecosystems, grant-related outreach |
| Technical publishers, societies, and conference partners | Academic publishers, associations, indexing partners, conference service providers | Influence visibility, content distribution, event partnerships | Useful for sponsorship, publication, and academic market access |
| Geographic Area | Likely Attendee Origin | Buyer Concentration | Notes |
|---|---|---|---|
| Jinan | Local universities, engineering institutes, and technology firms | Medium | Most likely source of host-city academic and technical participation |
| Shandong Province | Regional faculty, students, R&D engineers, applied research teams, manufacturing-linked technology professionals | High | Strong regional relevance due to event location and provincial industrial base |
| Nearby business and academic hubs | Beijing, Tianjin, Qingdao, Nanjing, Shanghai, and other East China research clusters | Medium to High | Likely sources of paper presenters, reviewers, and invited technical participants |
| National reach within China | Universities, institutes, and engineering enterprises from major Chinese innovation corridors | Medium | Typical for indexed international technical conferences hosted in China |
| International reach | Potential overseas paper authors, professors, and remote or in-person delegates | Low to Medium | International scope is likely from the conference branding, but the actual country mix is not publicly confirmed here |
| Reach Level | Assessment | Explanation |
|---|---|---|
| Global | Primary classification based on “International Conference” positioning | The event branding indicates cross-border academic reach, but current-year participant geography is not fully verified. |
| National | Secondary practical reach | For commercial targeting, the most actionable audience is likely China-based universities, labs, and engineering firms. |
| Regional | Strong regional pull | Jinan and wider Shandong participation is likely material given event location. |
| Buyer Company / Organization | Buyer Type | Why It Is Relevant | Website | Best Job Titles to Target | Evidence Level |
|---|---|---|---|---|---|
| Shandong University | University / research buyer | Major engineering and science institution in Jinan with likely relevance to electronics and informatics topics | sdu.edu.cn | Dean, Professor, Laboratory Director, Procurement Office, IT Director | Strong Market Fit, Attendance Not Confirmed |
| University of Jinan | University / research buyer | Host-city higher education institution with engineering and information disciplines | ujn.edu.cn | School Director, Research Office, Lab Manager, IT Manager | Strong Market Fit, Attendance Not Confirmed |
| Qilu University of Technology | University / applied technology buyer | Relevant for applied electronics, automation, and engineering collaboration | qlu.edu.cn | Research Director, Lab Head, Department Chair, Procurement Manager | Strong Market Fit, Attendance Not Confirmed |
| Harbin Institute of Technology | University / advanced engineering buyer | High relevance for electronics, control systems, computing, and smart technologies | hit.edu.cn | Professor, Institute Director, R&D Lead, Research Procurement | Strong Market Fit, Attendance Not Confirmed |
| Tsinghua University | University / flagship research buyer | Highly relevant for electronic engineering, computing, and national innovation research | tsinghua.edu.cn | Professor, Lab Director, Procurement Director, IT Infrastructure Lead | Strong Market Fit, Attendance Not Confirmed |
| Peking University | University / research buyer | Relevant for interdisciplinary informatics and advanced technology research | pku.edu.cn | Research Administrator, Department Head, Lab Manager, CIO | Strong Market Fit, Attendance Not Confirmed |
| Chinese Academy of Sciences | National research organization | Strong fit for advanced instrumentation, computation, and collaborative research activity | cas.cn | Institute Director, Principal Investigator, Procurement Office, Systems Engineer | Strong Market Fit, Attendance Not Confirmed |
| Huawei | Corporate R&D buyer | Relevant for communications, chips, AI, cloud, and engineering collaboration | huawei.com | R&D Director, Engineering Manager, Technical Procurement, Partnerships Director | Strong Market Fit, Attendance Not Confirmed |
| ZTE | Corporate R&D buyer | Relevant for telecom electronics, network systems, and engineering research collaboration | zte.com.cn | Engineering Director, Innovation Manager, Procurement Manager, CTO Office | Strong Market Fit, Attendance Not Confirmed |
| Inspur | Corporate technology buyer | Jinan-headquartered technology company relevant to computing, servers, AI, and digital infrastructure | inspur.com | Product Director, Engineering VP, R&D Procurement, Solution Architect Lead | Strong Market Fit, Attendance Not Confirmed |
| Priority | Job Title / Function | Department | Seniority Level | Why This Role Matters |
|---|---|---|---|---|
| 1 | Laboratory Director | Research / Engineering | Director | Often influences equipment, software, and research-service decisions |
| 2 | Professor / Principal Investigator | Academic Research | Senior | Shapes technical standards, research partnerships, and purchasing recommendations |
| 3 | Director of Research Administration | Research Administration | Director | Useful for grants, procurement workflow, and institutional partnerships |
| 4 | R&D Director | Engineering / Innovation | Director | Key commercial buyer influence for pilots, technical integration, and applied research |
| 5 | Engineering Manager | Engineering | Manager | Practical evaluator for tools, components, platforms, and services |
| 6 | Procurement Manager | Procurement | Manager | Useful where the offer is equipment, instrumentation, software, or institutional services |
| 7 | IT Director | Information Technology | Director | Relevant for compute infrastructure, storage, cloud, data, and cybersecurity offers |
| 8 | CTO / Chief Scientist | Executive / Technology | C-Level | Strategic role for high-value innovation partnerships |
| 9 | Partnerships Director | Business Development | Director | Important for university-industry collaboration and co-development programs |
| 10 | Program Manager | Research / Innovation Programs | Manager | Useful for funded projects, implementation timelines, and operational buying needs |
| Priority | Apollo Industry | Why It Fits the Event | Best Buyer Use Case |
|---|---|---|---|
| 1 | Higher Education | Core attendee base for technical conferences | Universities, departments, labs, schools of engineering |
| 2 | Research | Fits public and private research institutes | National labs, applied science centers, innovation institutes |
| 3 | Electrical/Electronic Manufacturing | Directly relevant to electronic engineering topics | Component vendors, device makers, systems companies |
| 4 | Computer Software | Relevant for informatics, analytics, AI, and engineering applications | Simulation, design, AI, research data platforms |
| 5 | Information Technology & Services | Broad fit for digital transformation and technical service providers | Cloud, IT services, data infrastructure, managed technical solutions |
| 6 | Semiconductors | Strong alignment with electronics and smart hardware research | Chips, test systems, prototyping, collaboration outreach |
| 7 | Industrial Automation | Relevant for embedded systems, control, robotics, and instrumentation | Applied engineering solutions and technology pilots |
| 8 | Computer Hardware | Relevant for instrumentation, devices, boards, and computing platforms | Hardware procurement and technical evaluation |
| 9 | Telecommunications | Likely relevant for communications engineering content | Networking, wireless systems, communications R&D |
| 10 | Government Administration | Useful where science bureaus and public research agencies are engaged | Innovation policy, grants, institutional procurement |
| Metric | Figure | Status | Source / Basis | Notes |
|---|---|---|---|---|
| Estimated total footfall | Attendance figure not publicly confirmed by the organizer. | Unconfirmed | No verified official attendance release available in the source set used here | A separate user-supplied reference mentioned 1,200+ participants, but it conflicts with the known city/date details and is not used as confirmed data. |
| Exhibitor count | Not publicly confirmed | Unconfirmed | No verified exhibitor directory located in the available source set | This event may have limited expo activity compared with commercial trade shows. |
| Buyer count | Not publicly confirmed | Unconfirmed | No verified buyer program or hosted-buyer release found | Conference is more likely attendee-led than structured procurement-led. |
| Speaker count | Not publicly confirmed | Unconfirmed | No verified agenda or speaker roster found | Typical academic conferences include keynote speakers, session chairs, and paper presenters. |
| Sponsor count | Not publicly confirmed | Unconfirmed | No verified sponsor page found | Possible sponsors may include publishers, universities, or technology firms, but none are confirmed here. |
| Historical attendance | Not publicly confirmed | Historical data unavailable | No prior-year official attendance figures verified | Prior-year participation evidence. Not a confirmed attendee list for the current edition. |
| Focus Area | Typical Buyer Need | Buyer Engagement Opportunity | Relevant Supplier Offering |
|---|---|---|---|
| Electronic engineering research | Test systems, measurement tools, components, prototyping support | Technical demos, proof-of-concept discussions, lab trials | Instrumentation, sensors, boards, embedded kits, engineering services |
| Informatics and computing | Software platforms, data processing, simulation, analytics tools | Platform evaluation, academic licensing, pilot deployment | Research software, AI tools, cloud resources, modeling environments |
| Smart technologies and embedded systems | Hardware-software integration, low-power systems, edge intelligence | Co-development and engineering design conversations | Embedded platforms, microcontrollers, AI edge devices, integration support |
| Digital transformation in engineering | Modernized R&D workflows, collaboration systems, digital labs | Institutional modernization conversations | Cloud, data infrastructure, cybersecurity, collaboration software |
| University-industry collaboration | Joint research, sponsored projects, talent pipelines | Partnership meetings and applied research scouting | Partnership programs, sponsored labs, training and co-innovation services |
| Factor | Assessment | Explanation |
|---|---|---|
| Buyer relevance | Medium | Best for research, lab, software, engineering, and innovation-oriented offers rather than broad procurement programs. |
| Decision-maker availability | Medium | Senior academic and technical influencers are likely present, but final procurement authority may sit elsewhere. |
| Data collection potential | Low to Medium | Public attendee data appears limited based on currently verified information. |
| Apollo targeting potential | High | Strong if targeting universities, research institutes, semiconductor firms, engineering software buyers, and R&D teams. |
| Geographic targeting potential | High | Jinan, Shandong, and wider East China provide a practical targeting corridor. |
| Best outreach approach | High | Use research collaboration, technical value, institutional case studies, and pilot offers instead of generic sales messaging. |
| Overall lead quality | Medium | Good niche event for advanced technology and research-aligned solutions; weaker for mass-market list building. |
| Best use case | High | Account-based outreach to research institutions, engineering faculties, and enterprise R&D teams. |
| Limitations / risks | Medium | Limited public attendee confirmation, likely higher academic share, and uncertain commercial buying density. |
| Filter Type | Recommended Filters | Purpose |
|---|---|---|
| Apollo industries | Higher Education; Research; Electrical/Electronic Manufacturing; Computer Software; Information Technology & Services; Semiconductors; Industrial Automation; Computer Hardware; Telecommunications; Government Administration | Build a focused list around academic, institutional, and technical buyers most aligned to EEI topics |
| Departments | Research, Engineering, Information Technology, Procurement, Operations, Business Development, Innovation | Targets both technical evaluators and approval-side stakeholders |
| Seniority | Manager, Director, VP, CXO, Owner where applicable, Professor-equivalent senior roles | Prioritize practical buyers and strategic decision-makers |
| Job titles | Laboratory Director, Professor, Principal Investigator, Research Director, R&D Director, Engineering Manager, Procurement Manager, IT Director, CTO, Partnerships Director, Program Manager | Mirror the most likely attendee and buyer influence roles |
| Geography | China; Shandong; Jinan; Beijing; Shanghai; Jiangsu; Tianjin; Qingdao; Shenzhen; Hangzhou | Start with the host region, then expand to major engineering hubs |
| Employee size | 201-500; 501-1,000; 1,001-5,000; 5,001-10,000; 10,001+ | Captures larger universities, institutes, and scaled technology firms |
| Keywords | electronic engineering, informatics, embedded systems, smart technology, semiconductor, laboratory, research center, AI, signal processing, communications, instrumentation, simulation | Improves precision for technically aligned organizations |
| Technologies | Use where relevant: cloud platforms, engineering software, simulation tools, lab information systems, AI stacks | Helpful when the client sells software or digital infrastructure |
| Revenue range | Use selectively for private-sector targets; less useful for university filtering | Best applied to enterprise R&D and technology companies |
| Company type | Educational institutions, research institutes, public sector research bodies, private technology enterprises | Separates academic prospects from commercial accounts |
| Source | Type | What It Verified | Reliability |
|---|---|---|---|
| User-supplied known event details | Provided event brief | Event title, city, region, country, start date, end date | Medium |
| User-supplied existing description for reference | Secondary background note | Provided thematic description only; contains conflicting city/date/venue data and was not used as confirmed event metadata | Low for event specifics; Medium for general thematic context |
| Official event website | Primary source target | Not publicly verified in the source set available for this report | Unavailable |
| Official organizer / agenda / attendee directory / venue page | Primary source target | No verified current-year attendee list, exhibitor list, buyer program, venue page, or attendance release was available in the source set used here | Unavailable |
| Institutional websites used for prospecting-fit examples: sdu.edu.cn, ujn.edu.cn, qlu.edu.cn, hit.edu.cn, tsinghua.edu.cn, pku.edu.cn, cas.cn, huawei.com, zte.com.cn, inspur.com | Organization websites | Used only to validate that the sample target organizations are real and sector-relevant; not proof of attendance at EEI 2026 | High for organization existence; not applicable for event attendance confirmation |
🎯 Selling to this event's audience? Get a free tailored buyer list
Tell us your work email and our AI instantly builds a buyer list matched to 2026 8th International Conference on Electronic Engineering and Informatics (EEI 2026) — the best‑fit companies to target, the exact decision‑maker job titles, and the industry filters that fit what you sell.