2026 8th International Conference on Circuits and Systems (ICCS 2026)
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About this event
2026 8th International Conference on Circuits and Systems (ICCS 2026)
About ICCS 2026
The 2026 8th International Conference on Circuits and Systems (ICCS 2026) will take place in Hangzhou, China, from September 18 to 21, 2026. As a premier global forum for advancements in circuits and systems, this conference builds on the legacy of its predecessors since 2017, offering a platform for researchers, engineers, and academics to share breakthroughs in theory, design, and implementation. ICCS 2026 is co-sponsored by the Hangzhou International Innovation Institute of Beihang University, Yangtze Delta Region Institute (Huzhou), and the University of Electronic Science and Technology of China. It is hosted by the State Key Laboratory of Spintronics/Yuhang Nano Center, with patronage from Fudan University (China), Auckland University of Technology (New Zealand), Zhejiang University (China), and INAOE (Mexico).
Conference Focus & Scope
ICCS 2026 emphasizes cutting-edge research in circuits and systems, spanning theoretical analysis, practical testing, design methodologies, and physical implementation. With the rapid evolution of technology, the conference explores interdisciplinary intersections with emerging fields such as the Internet of Things (IoT), big data, and artificial intelligence (AI). Key areas include:
- Electronic circuit design and optimization
- System architecture and integration
- Signal processing and embedded systems
- Nanotechnology and microelectronics
- Applications in IoT, AI, and smart technologies
Publication & Indexing
All accepted papers within IEEE’s technical scope will be published in the IEEE Conference Proceedings and indexed in IEEE Xplore. Post-conference, papers will be submitted for inclusion in Ei Compendex and Scopus. At least one author per accepted paper must present their work at the conference.
Important Dates
- Submission Deadline: July 20, 2026
- Notification of Acceptance: August 20, 2026
- Registration Deadline: August 30, 2026
- Camera-Ready Deadline: August 30, 2026
Keynote Speakers
-
Prof. Kiat Seng YEO
Tianjin University and Singapore University of Technology and Design
Fellow of Singapore Academy of Engineering, Canadian Academy of Engineering, and IEEE -
Prof. Wen-Sheng Zhao
Hangzhou Dianzi University
Vice Dean, School of Electronic Information (School of Integrated Circuit Science and Engineering)
Call for Papers
Researchers and practitioners are invited to submit original, high-quality papers addressing theoretical and applied challenges in circuits and systems. Topics of interest align with the conference’s focus areas listed above. Submissions must adhere to the provided templates and guidelines available on the official website.
Sponsored By
- Hangzhou International Innovation Institute of Beihang University
- Yangtze Delta Region Institute (Huzhou), University of Electronic Science and Technology of China
- State Key Laboratory of Spintronics/Yuhang Nano Center
Patronized By
- Fudan University (China)
- Auckland University of Technology (New Zealand)
- Zhejiang University (China)
- INAOE (Mexico)
Data sheet
2026 8th International Conference on Circuits and Systems (ICCS 2026) – Event Attendee & Buyer Profile Analysis
Event date: September 18–21, 2026
Location: Hangzhou, China
Event status: Upcoming
Research date: June 29, 2026
Event Overview
| Event Name | 2026 8th International Conference on Circuits and Systems (ICCS 2026) |
| Event Date | September 18–21, 2026 |
| Event Status | Upcoming |
| Venue | Hangzhou, China. Specific venue not publicly specified on the official homepage reviewed. |
| City | Hangzhou |
| State / Region | Not publicly specified on the official homepage reviewed |
| Country | China |
| Organizer | Co-sponsored by Hangzhou International Innovation Institute of Beihang University, Yangtze Delta Region Institute (Huzhou), and University of Electronic Science and Technology of China; hosted by State Key Laboratory of Spintronics / Yuhang Nano Center; patroned by Fudan University, Auckland University of Technology, Zhejiang University, and INAOE. |
| Official Event Website | iccs.org |
| Event Type | International academic and technical conference |
| Primary Category | Electric & Electronics |
| Secondary Applicable Categories | IT & Technology; Science & Research |
| Audience Reach | Global |
| Estimated Attendance / Expected Footfall | Attendance figure not publicly confirmed by the organizer. |
| Attendance Data Reliability | Low for headcount; high for dates, city, country, conference scope, organizers, publication route, and selected speaker organizations based on official website content. |
| Main Purpose of Event | To present research and engineering advances in circuits and systems, including theory, design, testing, implementation, and related emerging applications such as IoT, big data, and AI. |
About the Event
ICCS 2026 is the eighth edition of an international conference focused on circuits and systems research. According to the official event website, the conference will take place in Hangzhou, China, from September 18 to 21, 2026. Its scope covers theory, analysis, testing, design, and physical implementation, with stated relevance to interdisciplinary applications such as the Internet of Things, big data, and artificial intelligence.
From a commercial and partnership perspective, ICCS 2026 is most relevant for organizations selling research tools, electronic design technologies, semiconductor-related instrumentation, lab systems, academic partnerships, and advanced engineering solutions into universities, research institutes, and technical innovation centers. The event is not a mass-market expo; it is a specialist knowledge and relationship forum where technical decision-makers, principal investigators, faculty leaders, research labs, and applied engineering teams are likely to be active.
1. Who Attends: Buyers / Attendees
| Buyer / Attendee Segment | Typical Organizations | Buying Role or Influence | Relevance to Exhibitors / Suppliers |
|---|---|---|---|
| University faculty and lab heads | Engineering schools, microelectronics departments, circuits and systems labs | Influence equipment selection, research software adoption, and collaboration partnerships | High relevance for test equipment, simulation, prototyping, sensors, chip design tools, and technical services |
| Research institute scientists and program leaders | National labs, innovation institutes, state key laboratories, applied research centers | Drive project requirements, grant-linked purchases, and strategic research partnerships | High relevance for advanced instruments, materials, embedded systems, and custom R&D support |
| Semiconductor and electronics R&D teams | Chip design groups, electronics manufacturers, device engineering teams | Evaluate technical solutions, benchmark architectures, and identify research talent or collaborators | Relevant for EDA, testing, packaging, validation, specialty components, and applied research outsourcing |
| Graduate researchers and doctoral candidates | Academic labs and sponsored projects | Strong technical evaluators and future adopters; limited direct budget authority | Useful for product trials, educational licenses, and community penetration |
| Conference speakers and committee members | Senior professors, institute leaders, internationally recognized researchers | High influence on peer adoption, partnerships, and technology credibility | Strong targets for strategic partnerships, brand alignment, and reference relationships |
| Academic administrators and research office stakeholders | Innovation institutes, university research administration, funded program offices | May influence procurement workflows, collaboration approvals, and consortium participation | Relevant for institutional software, data platforms, and partnership proposals |
| Technical publishers and indexing stakeholders | IEEE proceedings ecosystem, journal partners | Indirect influence on publication and visibility choices | Relevant for research communications, indexing support, and scholarly tools |
2. Event Location and Attendee Geographic Origin
| Geographic Area | Likely Attendee Origin | Buyer Concentration | Notes |
|---|---|---|---|
| Hangzhou | Local universities, research centers, electronics faculty, and host-linked institutions | Medium to High | Host city confirmed on official website. |
| Eastern China / Yangtze Delta | Researchers and engineering teams from surrounding innovation hubs and partner institutions | High | Supported by presence of Yangtze Delta Region Institute (Huzhou) and regional academic ecosystem. |
| China-wide | National academic and technical attendees in circuits, systems, microelectronics, and electronics engineering | High | Chinese co-sponsors, hosts, and patrons indicate strong national relevance. |
| Asia-Pacific | Regional researchers, technical speakers, and collaboration-seeking institutions | Medium | International positioning and English-language conference format support wider reach. |
| Global | International research institutions, patrons, and publication-oriented authors | Medium | Global character supported by international patrons including New Zealand and Mexico and IEEE proceedings pathway. |
3. Audience Reach
| Reach Level | Assessment | Explanation |
|---|---|---|
| Global | Primary classification | ICCS presents itself as an international conference and is supported by institutions from China, New Zealand, and Mexico, with IEEE conference proceedings publication and indexing submission. |
| National | Secondary practical reach | The strongest concentration is likely to come from Chinese universities, institutes, and engineering groups due to location and organizer base. |
4. Sample Buyer Companies and Websites
| Buyer Company / Organization | Buyer Type | Why It Is Relevant | Website | Best Job Titles to Target | Evidence Level |
|---|---|---|---|---|---|
| Hangzhou International Innovation Institute of Beihang University | Research institute / co-sponsor | Confirmed co-sponsor with likely interest in research infrastructure, lab systems, and engineering collaboration | h3i.buaa.edu.cn | Institute Director, Research Professor, Lab Director, Procurement Office, Program Manager | Confirmed Current-Year Participant |
| Yangtze Delta Region Institute (Huzhou) | Research institute / co-sponsor | Confirmed co-sponsor relevant for industry-university collaboration and applied technology sourcing | No verified official domain confirmed from reviewed source | Institute Leadership, Research Program Director, Partnership Director, Procurement Stakeholder | Confirmed Current-Year Participant |
| University of Electronic Science and Technology of China | University / co-sponsor | Confirmed co-sponsor in electronics and semiconductor-related research fields | uestc.edu.cn | Dean, Professor, Research Center Director, Lab Manager, Technical Procurement Lead | Confirmed Current-Year Participant |
| State Key Laboratory of Spintronics / Yuhang Nano Center | National research lab / host | Confirmed host; directly relevant for nanoscale devices, testing, instrumentation, and advanced electronics tooling | No verified standalone domain confirmed from reviewed source | Lab Director, Principal Investigator, Research Engineer, Technical Operations Lead | Confirmed Current-Year Participant |
| Fudan University | University / patron | Confirmed patron with strong electronics and semiconductor research relevance | fudan.edu.cn | Professor, Research Institute Director, Department Chair, Lab Procurement Stakeholder | Confirmed Current-Year Participant |
| Auckland University of Technology | University / patron | Confirmed international patron, useful for academic partnerships and engineering research outreach | aut.ac.nz | Professor, Research Office, Department Head, Innovation Partnership Lead | Confirmed Current-Year Participant |
| Zhejiang University | University / patron | Confirmed patron and highly relevant local-regional research buyer profile | zju.edu.cn | Professor, Lab Director, School Administrator, Engineering Procurement Contact | Confirmed Current-Year Participant |
| INAOE | Research institute / patron | Confirmed patron demonstrating international technical and research relevance | inaoep.mx | Research Director, Principal Scientist, Academic Partnership Lead | Confirmed Current-Year Participant |
| Tianjin University | University / keynote speaker organization | Current keynote speaker affiliation indicates senior technical presence | tju.edu.cn | Professor, Center Director, Research Collaborations Lead | Confirmed Speaker Organization |
| Singapore University of Technology and Design | University / keynote speaker organization | Current keynote speaker affiliation supports international technical audience relevance | sutd.edu.sg | Professor, Research Program Head, Electronics Lab Lead | Confirmed Speaker Organization |
| Hangzhou Dianzi University | University / keynote speaker organization | Current keynote speaker affiliation and direct local relevance to integrated circuits research | hdu.edu.cn | Vice Dean, Professor, IC School Leadership, Lab Director | Confirmed Speaker Organization |
| Tsinghua University | University / prior-year invited speaker organization | Strong circuits and microelectronics buyer profile; official site shows prior-year speaker participation evidence | tsinghua.edu.cn | Associate Professor, Professor, Lab Head, Research Procurement Contact | Prior-Year Participation Evidence |
| Southern University of Science and Technology | University / prior-year invited speaker organization | Relevant for electronics, semiconductor, and systems research procurement | sustech.edu.cn | Assistant Professor, Center Director, Research Operations Lead | Prior-Year Participation Evidence |
| Hong Kong University of Science and Technology (Guangzhou) | University / prior-year invited speaker organization | Relevant for advanced electronics and interdisciplinary systems research | hkust-gz.edu.cn | Assistant Professor, Program Director, Research Lab Lead | Prior-Year Participation Evidence |
| Institute of Microelectronics, Chinese Academy of Sciences | Research institute / prior-year invited speaker organization | Highly relevant for semiconductor research, fabrication support, and advanced lab procurement | ime.ac.cn | Research Scientist, Institute Director, Lab Manager, Technical Procurement Lead | Prior-Year Participation Evidence |
Prior-year participation evidence. Not a confirmed attendee list for the current edition.
5. Job Profiles, Industries and Event Type
| Priority | Job Title / Function | Department | Seniority Level | Why This Role Matters |
|---|---|---|---|---|
| 1 | Professor / Principal Investigator | Research / Engineering | Senior | Often defines lab priorities, research directions, vendor selection influence, and collaboration decisions. |
| 2 | Lab Director | Research Operations | Director | Controls technical operations, instrument usage, and implementation of new research infrastructure. |
| 3 | Research Center Director | Research Administration | Director | High-value contact for institutional partnerships, platform purchases, and funded initiatives. |
| 4 | Dean / Vice Dean | Academic Leadership | Executive / Senior | Can influence school-wide initiatives, partnerships, curriculum technology, and capital planning. |
| 5 | Research Engineer | Engineering / Technical | Manager / Individual Contributor | Strong user-level evaluator for tools, components, embedded systems, and lab equipment. |
| 6 | Program Manager | Research Programs / Innovation | Manager | Useful for funded project coordination, implementation timelines, and vendor onboarding. |
| 7 | Procurement Manager | Procurement | Manager | Important for institutional purchase processes even when end users are technical teams. |
| 8 | Partnerships Director | External Relations / Innovation | Director | Relevant for co-development, sponsored research, and international collaboration. |
| 9 | Department Chair | Academic Department | Senior | Influences department-level research equipment and academic partnerships. |
| 10 | CTO / R&D Director | Technology / R&D | Executive / Director | Relevant for commercial electronics and semiconductor firms participating for technical scouting. |
| Priority | Apollo Industry | Why It Fits the Event | Best Buyer Use Case |
|---|---|---|---|
| 1 | Electrical/Electronic Manufacturing | Direct alignment with circuits, systems, embedded electronics, and design implementation | EDA tools, test systems, embedded hardware, validation platforms |
| 2 | Semiconductors | Core fit for IC, device, and chip-related research communities | Research collaboration, design verification, device characterization |
| 3 | Research | The conference is research-centric and includes laboratories and institutes | Lab systems, publication support, collaboration outreach |
| 4 | Higher Education | Universities are confirmed organizers, patrons, and speaker affiliations | Department outreach, research equipment, campus lab solutions |
| 5 | Computer Hardware | Relevant to hardware architecture, prototyping, and performance testing | Boards, controllers, compute platforms, interfaces |
| 6 | Industrial Automation | Systems engineering and implementation topics overlap with automation controls | Control systems, embedded applications, instrumentation |
| 7 | Information Technology & Services | Relevant where systems research intersects with AI, IoT, and data | Platforms, analytics, middleware, technical services |
| 8 | Computer Software | Useful for simulation, modeling, verification, and workflow tools | CAD, simulation, data analysis, workflow automation |
| 9 | Nanotechnology | Host organization references spintronics and nano-center capabilities | Advanced materials, nanoscale characterization, micro-device research |
| 10 | Aviation & Aerospace | Beihang-linked institutions may create overlap with aerospace electronics and systems | High-reliability circuits, sensing, embedded systems R&D |
6. Estimated Attendance
| Metric | Figure | Status | Source / Basis | Notes |
|---|---|---|---|---|
| Estimated total footfall | Attendance figure not publicly confirmed by the organizer. | Unconfirmed | Official homepage reviewed | No official delegate count found in reviewed source. |
| Exhibitor count | Not publicly confirmed | Unconfirmed | Official homepage reviewed | This appears to be a conference rather than a trade exhibition. |
| Buyer count | Not publicly confirmed | Unconfirmed | Official homepage reviewed | Event is academically oriented; buyer-side participation is indirect via labs, institutes, and university stakeholders. |
| Confirmed keynote speaker count shown on homepage | 2 | Confirmed | Official homepage speaker section | Prof. Kiat Seng Yeo and Prof. Wen-Sheng Zhao were shown in the reviewed content. |
| Confirmed co-sponsors | 3 | Confirmed | Official homepage | Hangzhou International Innovation Institute of Beihang University; Yangtze Delta Region Institute (Huzhou); University of Electronic Science and Technology of China. |
| Confirmed host organizations shown | 1 host grouping | Confirmed | Official homepage | State Key Laboratory of Spintronics / Yuhang Nano Center. |
| Confirmed patron institutions | 4 | Confirmed | Official homepage | Fudan University; Auckland University of Technology; Zhejiang University; INAOE. |
| Historical attendance | Not publicly confirmed in reviewed source | Historical data unavailable | Official homepage reviewed | Past editions are listed, but no participant counts were shown in the reviewed text. |
7. Key Focus Areas and Buyer Engagement
| Focus Area | Typical Buyer Need | Buyer Engagement Opportunity | Relevant Supplier Offering |
|---|---|---|---|
| Circuit design | Modeling, simulation, verification, and design workflow efficiency | Target faculty, lab heads, and design researchers | EDA software, simulation tools, verification platforms |
| Systems implementation | Prototyping, embedded integration, and hardware validation | Engage research engineers and project leaders | Development kits, controllers, interfaces, validation rigs |
| Testing and measurement | Precision characterization and repeatable lab performance | Best for labs, institutes, and device research groups | Oscilloscopes, analyzers, wafer test support, metrology tools |
| IoT | Low-power systems, sensing, connectivity, deployment frameworks | Approach interdisciplinary engineering groups | Sensors, edge modules, connectivity stacks, embedded software |
| Big data | Data handling, experiment analytics, modeling support | Useful for institutions building scalable research workflows | Data platforms, storage, analytics environments |
| Artificial intelligence | Hardware-software co-design, acceleration, intelligent system research | Connect with advanced systems researchers and interdisciplinary labs | AI hardware tools, acceleration platforms, data pipelines |
| Publication and academic visibility | Indexing, paper management, dissemination support | Relevant for authors and institutions focused on research output | Scholarly workflow tools, research communication services |
| International collaboration | Joint projects, lab partnerships, institutional outreach | Best with co-sponsors, patrons, and speaker organizations | Research partnerships, consortium participation, sponsored programs |
Lead Quality Assessment
| Factor | Assessment | Explanation |
|---|---|---|
| Buyer relevance | Medium to High | Strong if selling research tools, semiconductor technology, academic software, or technical services; weaker for general commercial products. |
| Decision-maker availability | Medium | Senior academic and lab leaders are likely present, but institutional procurement may remain distributed. |
| Data collection potential | Medium | Confirmed organization data is available; attendee headcount and open attendee directories were not confirmed in reviewed source. |
| Apollo targeting potential | High | Good fit for targeting universities, research institutes, semiconductor firms, and electronics engineering roles. |
| Geographic targeting potential | High | China-focused core audience with credible international overlays. |
| Best outreach approach | High-value account-based outreach | Lead with technical relevance, research outcomes, lab efficiency, and collaboration value rather than generic sales messaging. |
| Overall lead quality | High for niche B2B / research sales | Especially strong for advanced electronics, semiconductors, research instrumentation, and academic partnerships. |
| Best use case | Strategic prospecting and partnership mapping | Best suited for targeted account lists rather than broad attendee list monetization. |
| Limitations / risks | Medium | No public attendee count found; open buyer/exhibitor lists were not confirmed; academic attendees may require longer sales cycles. |
Apollo.io Targeting Recommendation
| Filter Type | Recommended Filters | Purpose |
|---|---|---|
| Apollo industries | Semiconductors; Electrical/Electronic Manufacturing; Research; Higher Education; Computer Hardware; Computer Software; Information Technology & Services; Industrial Automation; Nanotechnology; Aviation & Aerospace | Covers the most likely technical and institutional buyer universe around the conference. |
| Departments | Engineering; Research; Information Technology; Operations; Procurement; Education | Captures technical users plus institutional enablers. |
| Seniority | Owner; Partner; CXO; VP; Director; Head; Manager; Senior | Useful for filtering to decision-makers and high-influence researchers. |
| Job titles | Professor, Principal Investigator, Lab Director, Research Director, Dean, Vice Dean, Department Chair, Research Engineer, R&D Director, Procurement Manager, Partnerships Director, Program Manager | Builds lists around actual likely conference participants and buying influencers. |
| Geography | China first; add Hong Kong SAR, Singapore, New Zealand, and Mexico for international collaboration targeting | Reflects organizer base and confirmed international institutional links. |
| Employee size | 201–500; 501–1,000; 1,001–5,000; 5,001–10,000; 10,001+ | Large universities, institutes, and established engineering organizations fit best. |
| Keywords | circuits, systems, integrated circuits, microelectronics, semiconductor, spintronics, nano, embedded, IoT, AI hardware, signal processing, device testing, EDA | Helps isolate organizations closely aligned to conference themes. |
| Technologies, if relevant | EDA, FPGA, embedded systems, lab instrumentation, wafer testing, simulation platforms | Useful when prospecting technology-specific buyers. |
| Revenue range, if relevant | Use selectively for commercial electronics firms; less reliable for universities and public institutes | Avoid over-filtering academic accounts. |
| Company type | Private; Public Company; Educational; Government; Nonprofit Organization | Broadens capture of universities, institutes, and commercial R&D targets. |
Suggested Apollo Search Logic: ("circuits" OR "integrated circuits" OR microelectronics OR semiconductor OR spintronics OR "embedded systems" OR IoT OR "AI hardware") AND (Professor OR "Lab Director" OR "Research Director" OR Dean OR "R&D Director" OR "Procurement Manager") AND (China OR Singapore OR "New Zealand" OR Mexico).
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Sources & Verification Notes
| Source | Type | What It Verified | Reliability |
|---|---|---|---|
| ICCS 2026 Official Website | Official event website | Confirmed conference name, dates, city, country, conference scope, co-sponsors, host, patrons, publication details, important dates, and displayed speaker organizations. | High |
| IEEE Conference Details Listing | Official conference registry listing | Supports the event’s IEEE conference listing status as referenced by the organizer. | High |
| Official website historical sections for ICCS 2025 / 2024 / 2023 / 2022 / 2021 / 2020 | Organizer historical archive references | Verified that the conference has prior editions and prior-year speaker references. No attendance totals confirmed from the reviewed text. | Medium to High |
| Reviewed official homepage content provided in the brief | Primary source extract | Used as primary source of truth for date, location, organizer structure, and publicly visible speaker affiliations. Specific venue name and attendance count were not found in the reviewed extract. | High |
Suitability for B2B attendee list building: Moderate for targeted institutional account mapping; limited for high-volume attendee list sales because no public current-year attendee directory or confirmed headcount was identified in the reviewed official source.
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Tell us your work email and our AI instantly builds a buyer list matched to 2026 8th International Conference on Circuits and Systems (ICCS 2026) — the best‑fit companies to target, the exact decision‑maker job titles, and the industry filters that fit what you sell.
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