2026 15th International Conference on Communications, Circuits, and Systems (ICCCAS 2026)
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About this event
2026 15th International Conference on Communications, Circuits, and Systems (ICCCAS 2026)
Date: July 7–10, 2026
Venue: Takasaki, Gunma, Japan
Event Type: Academic & Industry Conference focused on Communications, Circuits, and Systems Technologies
1️⃣ Who attends (BUYERS / ATTENDEES)
ICCCAS 2026 attracts a hybrid audience of academic and industry professionals. Key buyer profiles include:
- Research Scientists and Engineers
- University Professors and PhD Researchers
- Technical Directors at Tech Companies
- R&D Managers in Telecommunications & Electronics
- Procurement Teams for Academic Equipment/Software
- Industry Partners Seeking Innovation Collaborations
- Government & Institutional Funding Representatives
2️⃣ Location + Attendee Geographic Origin
Event Location: Takasaki, Gunma, Japan
Attendee Origin: Global, with strong representation from Asia-Pacific (China, Japan, South Korea), North America, and Europe. Historical editions show ~40% academic institutions and ~60% industry participation.
3️⃣ Audience Reach
Reach Type: Global
The conference has international participation, indexed in IEEE Xplore, Scopus, and Ei Compendex. Attendees include multinational corporations, leading research universities, and government labs.
4️⃣ Sample Buyer Company Names + Websites
| Priority | Company | Website | Best Title to Target | Why This is a Good Buyer Fit |
|---|---|---|---|---|
| 1 | Intel Corporation | https://www.intel.com | Director, Wireless Research | Key focus on 5G/6G, IoT, and AI chips aligns with conference themes |
| 2 | Ericsson AB | https://www.ericsson.com | Principal Engineer, Network Systems | Global leader in communications technology seeking innovation |
| 3 | University of Tokyo | https://www.u-tokyo.ac.jp | Professor, Department of Electronics | Academic research collaboration and recruitment opportunities |
| 4 | Siemens AG | https://www.siemens.com | Head of Industrial Automation R&D | Interest in circuits, edge computing, and system applications |
| 5 | Qualcomm Inc. | https://www.qualcomm.com | Senior Director, Technology Standards | Active participant in communications standards and innovation |
| 6 | Stanford University | https://www.stanford.edu | Associate Dean, Engineering Research | Seeking cutting-edge research collaborations and talent |
| 7 | Hitachi, Ltd. | https://www.hitachi.com | Chief Engineer, Electronic Systems | Japan-based conglomerate with interests in multiple conference tracks |
| 8 | MIT Lincoln Laboratory | https://www.ll.mit.edu | Technical Staff, Communications Systems | Government-funded R&D with global impact |
| 9 | Nokia Corporation | https://www.nokia.com | Research Program Manager, 6G | Forward-looking focus on next-gen communications |
| 10 | Texas Instruments | https://www.ti.com | Senior Design Engineer, Analog ICs | Circuit design expertise and recruitment needs |
| 11 | Chinese Academy of Sciences | http://www.cas.ac.cn | Director, Institute of Semiconductors | Major research hub in Asia-Pacific region |
| 12 | IBM Research | https://www.research.ibm.com | Research Scientist, Quantum Computing | Interest in advanced systems and circuits |
| 13 | University of California, Berkeley | https://www.berkeley.edu | Professor, Electrical Engineering & Computer Sciences | Top-tier academic institution with active research programs |
| 14 | Samsung Electronics | https://www.samsung.com | Senior Engineer, Wireless Communications | Korean multinational with broad technology interests |
| 15 | European Organization for Nuclear Research (CERN) | https://home.cern | Engineer, Electronics Division | Specialized needs for high-precision systems |
5️⃣ Job Profiles, Industries & Event Type
Best Job Profiles to Target:
- Director of R&D
- Principal Engineer
- Professor/Researcher in Electronics/ECE
- Technical Program Manager
- IP Strategist (for patent-related services)
- Academic Partnership Manager
Relevant Industries (Apollo Classification):
- Information Technology & Services
- Electrical/Electronic Manufacturing
- Telecommunications
- Computer Hardware
- Higher Education
- Research
- Computer Software
6️⃣ Estimated Attendance
Based on historical data and conference growth patterns:
- Estimated total attendees: 800–1,200
- Academic researchers: ~60%
- Industry professionals: ~35%
- Government/Institutional representatives: ~5%
7️⃣ Key Focus Areas & Buyer Engagement
Core Themes:
- 5G/6G Wireless Communications
- Integrated Circuits & VLSI Design
- IoT & Edge Computing Architectures
- AI Hardware & Neuromorphic Chips
- System-on-Chip (SoC) Applications
- Quantum Computing Circuits
Engagement Angle: Position your offering as a catalyst for innovation in these technical areas, emphasizing academic-industry collaboration opportunities.
8️⃣ Client-Product Fit Note
Please share your client's website to enable precise buyer targeting. For example:
- If selling EDA tools: Target Principal Engineers at Intel, TI, and Samsung
- If offering academic software licenses: Engage Professors at MIT, UC Berkeley
- If providing testing equipment: Focus on R&D Managers at Ericsson, Huawei
9️⃣ Final Recommendation
ICCCAS 2026 offers high-value academic and industry connections for companies involved in electronics, communications, and advanced systems. Best suited for:
- Technology providers seeking R&D partnerships
- Academic institutions building global networks
- Recruitment of specialized technical talent
- Publisher of technical journals/conference services
Quality Rating for B2B Engagement: 8.5/10 (Strong technical focus, global reach, but smaller scale compared to trade shows)
Data sheet
2026 15th International Conference on Communications, Circuits, and Systems (ICCCAS 2026) – Event Attendee & Buyer Profile Analysis
Event date: July 7–10, 2026
Location: G MESSE GUNMA, Takasaki, Gunma, Japan
Event status: Upcoming
Research date: June 29, 2026
Event Overview
| Event Name | 2026 15th International Conference on Communications, Circuits, and Systems (ICCCAS 2026) |
| Event Date | July 7–10, 2026 |
| Event Status | Upcoming |
| Venue | G MESSE GUNMA |
| City | Takasaki |
| State / Region | Gunma |
| Country | Japan |
| Organizer | Co-sponsored by University of Electronic Science and Technology of China, Wuhan University of Technology, and IEEE; hosted by Gunma University and Xiamen University; technically co-sponsored by IEEE CASS Japan Joint Chapter |
| Official Event Website | icccas.org |
| Event Type | Academic & Industry Conference |
| Primary Category | IT & Technology |
| Secondary Applicable Categories | Electric & Electronics; Science & Research; Telecommunication |
| Audience Reach | Global |
| Estimated Attendance / Expected Footfall | Attendance figure not publicly confirmed by the organizer. |
| Attendance Data Reliability | Low for attendance size; high for event dates, city, country, conference scope, and organizing bodies. |
| Main Purpose of Event | Research presentation, technical exchange, publication, academic-industry collaboration, and innovation networking in communications, circuits, and systems. |
About the Event
ICCCAS 2026 is the 15th edition of the International Conference on Communications, Circuits, and Systems, scheduled for July 7–10, 2026 in Takasaki, Gunma, Japan. According to the official event website, the conference is co-sponsored by the University of Electronic Science and Technology of China, Wuhan University of Technology, and IEEE; hosted by Gunma University and Xiamen University; and technically co-sponsored by the IEEE CASS Japan Joint Chapter. The program is positioned around emerging developments in communication technologies, circuit design, system applications, IoT, edge computing, and AI chips.
From a commercial intelligence perspective, ICCCAS is best viewed as a high-value technical and innovation networking event rather than a mass-market trade show. The strongest attendee segments are researchers, professors, lab leaders, engineering teams, technical directors, R&D managers, and institutional stakeholders involved in advanced electronics, communications, semiconductor, and systems research. This makes the event relevant for partnership development, technical solution outreach, academic procurement support, research software/tooling sales, and long-cycle B2B engagement with engineering-led buyers.
1. Who Attends: Buyers / Attendees
| Buyer / Attendee Segment | Typical Organizations | Buying Role or Influence | Relevance to Exhibitors / Suppliers |
|---|---|---|---|
| University professors and principal investigators | Engineering schools, communications labs, semiconductor research groups | Influence research equipment, simulation software, testing tools, datasets, and lab partnerships | High relevance for research platforms, EDA tools, instrumentation, publication services, and technical partnerships |
| PhD researchers and postdoctoral scholars | Universities, public research institutes, technical laboratories | Strong technical evaluators; can influence trial adoption and future procurement | Useful for early adoption campaigns, demo requests, academic pilots, and technical validation |
| R&D managers and engineering directors | Telecom, electronics, semiconductor, embedded systems, and AI hardware firms | Budget and roadmap influence for prototyping, design tools, component sourcing, and collaborative research | High-value targets for solution selling, joint development, and proof-of-concept partnerships |
| Technical directors and systems architects | Communications infrastructure providers, integrated circuit developers, advanced systems companies | Set technical standards, approve architectures, shortlist suppliers | Best suited for high-complexity technical offerings and enterprise engineering outreach |
| Procurement teams for academic and technical infrastructure | Universities, laboratories, research centers | Handle vendor onboarding, quotation review, institutional purchasing | Relevant for lab equipment vendors, software licensors, instrumentation providers, and training suppliers |
| Industry collaboration and partnership teams | Universities, R&D centers, innovation offices, corporate strategy teams | Support co-development, sponsored research, licensing, and commercialization | Strong relevance for technology transfer, research sponsorship, and ecosystem partnerships |
| Government and institutional funding stakeholders | Science agencies, innovation bodies, public research programs | Influence grant priorities, consortium formation, and public research funding | Relevant for consortium-building, pilot projects, and publicly funded innovation initiatives |
| Journal and publication ecosystem stakeholders | IEEE publication ecosystem, indexed journals, conference proceedings channels | Influence scholarly dissemination and technical visibility rather than direct procurement | Useful for brand credibility, thought leadership, and research market positioning |
2. Event Location and Attendee Geographic Origin
| Geographic Area | Likely Attendee Origin | Buyer Concentration | Notes |
|---|---|---|---|
| Takasaki | Local host-city attendees, venue-based participants, university affiliates | Low to medium | Host-city participation likely concentrated around event staff, local academics, and regional collaborators |
| Gunma Prefecture | Regional university, lab, and engineering attendees | Medium | Host institution presence increases relevance for Japanese academic and technical communities |
| Greater Kanto / nearby business hubs | Tokyo, Yokohama, Saitama, Chiba, and nearby technology corridors | High | Strong likelihood of participation from electronics, telecom, systems, and university ecosystems across the wider region |
| Japan national market | Researchers, engineers, institutions, and corporate R&D teams from across Japan | High | IEEE affiliation and Japan hosting support national technical draw |
| Asia-Pacific | China, South Korea, Taiwan, Singapore, and broader APAC research and industry communities | High | Confirmed Chinese co-sponsors and host affiliations support strong cross-border APAC participation |
| International | North America, Europe, and other global research communities | Medium | Global paper submissions and indexing visibility support international attendance, though attendee count is not publicly confirmed |
3. Audience Reach
| Reach Level | Assessment | Explanation |
|---|---|---|
| Global | Primary classification | The conference invites worldwide academic and industry participants, has IEEE-linked proceedings submission, and promotes publication visibility through IEEE Xplore, Ei Compendex, and Scopus indexing pathways. |
| Asia-Pacific | Secondary concentration | Japan and China-based sponsorship and hosting make APAC the most likely concentration for technical and institutional participation. |
4. Sample Buyer Companies and Websites
| Buyer Company / Organization | Buyer Type | Why It Is Relevant | Website | Best Job Titles to Target | Evidence Level |
|---|---|---|---|---|---|
| Gunma University | Host university | Confirmed host institution; relevant for lab procurement, research collaboration, and academic technology outreach | gunma-u.ac.jp | Professor, Principal Investigator, Lab Director, Procurement Officer, Research Administrator | Confirmed Current-Year Participant |
| Xiamen University | Host university | Confirmed host; relevant for communications and systems research collaboration and institutional procurement influence | xmu.edu.cn | Dean, Professor, Research Fellow, International Cooperation Director, Purchasing Officer | Confirmed Current-Year Participant |
| University of Electronic Science and Technology of China | Co-sponsoring university | Conference founder institution and confirmed co-sponsor; highly relevant to advanced electronics and communications research engagement | uestc.edu.cn | Research Director, PI, Department Chair, Technical Program Lead, Procurement Manager | Confirmed Current-Year Participant |
| Wuhan University of Technology | Co-sponsoring university | Confirmed co-sponsor with engineering and technical research relevance | whut.edu.cn | Professor, Lab Director, Research Manager, Procurement Officer, Collaboration Director | Confirmed Current-Year Participant |
| IEEE | Professional association / co-sponsor | Confirmed co-sponsor; relevant for standards, publication, technical community access, and ecosystem credibility | ieee.org | Program Manager, Conference Operations, Technical Activities Lead, Partnerships Manager | Confirmed Current-Year Participant |
| IEEE CASS Japan Joint Chapter | Technical co-sponsor | Confirmed technical co-sponsor aligned directly with circuits and systems community engagement | ieee-cas.org | Chapter Chair, Technical Committee Member, Academic Liaison, Industry Liaison | Confirmed Current-Year Participant |
Publicly verified current-year buyer-side organization data is limited on the official website. The table above includes only organizations explicitly named by the organizer as current-year sponsors, hosts, or technical partners. No official attendee list, buyer list, or exhibitor directory was publicly confirmed in the source material reviewed.
5. Job Profiles, Industries and Event Type
| Priority | Job Title / Function | Department | Seniority Level | Why This Role Matters |
|---|---|---|---|---|
| 1 | Professor / Principal Investigator | Research / Engineering | Senior / Director | Core technical buyer influence for academic tools, instrumentation, and research collaborations |
| 2 | R&D Manager | Research & Development | Manager | Evaluates technology fit, pilots, and engineering partnerships |
| 3 | Engineering Director | Engineering | Director | Approves higher-value design and systems investments |
| 4 | Technical Director | Engineering / Technology | Director | Owns architecture decisions and supplier evaluation criteria |
| 5 | Lab Director | Research Operations | Director | Key contact for technical infrastructure and usage requirements |
| 6 | Procurement Manager | Procurement | Manager | Supports vendor onboarding, quotations, and institutional purchase processes |
| 7 | Research Administrator | Administration / Grants | Manager | Important for funded projects, institutional purchasing, and compliance workflows |
| 8 | Partnerships Director | Business Development / External Relations | Director | Relevant for sponsored research, licensing, and strategic alliances |
| 9 | CTO | Executive / Technology | C-Level | Relevant for advanced industry-side adoption and long-term technology direction |
| 10 | Program Manager | Research Programs / Engineering | Manager | Coordinates technical projects, consortium activities, and implementation timelines |
| Priority | Apollo Industry | Why It Fits the Event | Best Buyer Use Case |
|---|---|---|---|
| 1 | Higher Education | Core attendee base for professors, labs, and research institutions | Academic procurement, lab tools, research software, collaboration outreach |
| 2 | Research | Direct fit for institutes and technical research organizations | Joint R&D, grants, prototypes, technology validation |
| 3 | Telecommunications | Conference scope includes 5G/6G and communication technologies | Network systems, RF tools, communications hardware and software |
| 4 | Semiconductors | Strong relevance to integrated circuits and AI chips | Chip design tools, testing, packaging-adjacent engineering support |
| 5 | Electrical/Electronic Manufacturing | Relevant to electronics design and systems applications | Components, test systems, design validation, engineering services |
| 6 | Computer Hardware | Relevant for edge computing, systems, embedded platforms, AI hardware | Prototype hardware, processing platforms, integration support |
| 7 | Computer Software | Covers simulation, design, modeling, and analytics software use cases | EDA, signal processing, workflow automation, AI-assisted research |
| 8 | Information Technology & Services | Broad fit for enterprise technology and systems partners | Technical services, implementation, cloud-linked engineering support |
| 9 | Industrial Automation | Systems and circuits content aligns with control and embedded applications | Sensor systems, embedded control, industrial communications |
| 10 | Aviation & Aerospace | Relevant for advanced communications and systems research applications | Mission-critical electronics, signal systems, sensing technologies |
| 11 | Defense & Space | Communications and systems research may intersect with secure and advanced applications | High-performance systems, sensing, circuit design, advanced signal platforms |
| 12 | Government Administration | Relevant where public labs and funded technical programs participate | Grants, public research initiatives, procurement pathways |
6. Estimated Attendance
| Metric | Figure | Status | Source / Basis | Notes |
|---|---|---|---|---|
| Estimated total footfall | Attendance figure not publicly confirmed by the organizer. | Unconfirmed | Official website reviewed | No attendee number published in the reviewed official content |
| Exhibitor count | Not publicly confirmed | Unconfirmed | Official website reviewed | This appears to be a conference format rather than a large exhibition-led trade show |
| Buyer count | Not publicly confirmed | Unconfirmed | Official website reviewed | No official buyer or attendee segmentation disclosed |
| Speaker count | Not publicly confirmed in reviewed content | Unconfirmed | Official website navigation indicates speaker pages exist | Specific speaker roster not included in the provided source text |
| Sponsor / organizing institution count | 6 named organizations | Confirmed | Official website text | Includes co-sponsors, hosts, and technical co-sponsor explicitly named |
| Historical attendance | Not publicly confirmed in the reviewed source | Historical / prior-year evidence unavailable for headcount | Official website reviewed | Publication history is available, but attendance history is not |
7. Key Focus Areas and Buyer Engagement
| Focus Area | Typical Buyer Need | Buyer Engagement Opportunity | Relevant Supplier Offering |
|---|---|---|---|
| 5G / 6G communications | Advanced communications research, signal performance, network innovation | Technical demos, research partnerships, standards-aligned solution outreach | RF tools, simulation platforms, communications hardware, testing solutions |
| Integrated circuits | Design, validation, prototyping, optimization | Meet engineering leads and academic labs shaping circuit innovation | EDA software, test equipment, design services, semiconductor IP support |
| Internet of Things (IoT) | Connectivity, embedded integration, sensor systems | Target system architects, embedded engineers, and university labs | IoT platforms, modules, edge devices, firmware tools |
| Edge computing | Low-latency processing, distributed systems, hardware/software optimization | Position performance-focused infrastructure and compute solutions | Embedded compute, edge servers, orchestration software, acceleration tools |
| AI chips | Hardware acceleration, inference efficiency, design innovation | Engage semiconductor R&D teams and advanced computing researchers | Chip tooling, optimization software, validation platforms, AI hardware services |
| Academic publication and technical visibility | Research dissemination, credibility, citation pathways | Thought leadership, publication support, research community positioning | Publishing support, conference services, research software, collaboration tools |
Lead Quality Assessment
| Factor | Assessment | Explanation |
|---|---|---|
| Buyer relevance | High | Best for technical, research, lab, engineering, and innovation-focused offerings rather than general consumer or commodity products. |
| Decision-maker availability | Medium | Technical influencers are likely present; final procurement sign-off may sit with separate institutional or corporate stakeholders. |
| Data collection potential | Medium | Good potential through authors, committees, speakers, and institutional outreach, but a public attendee list was not verified. |
| Apollo targeting potential | High | Targeting is practical through Higher Education, Research, Telecommunications, Semiconductors, and engineering leadership job titles. |
| Geographic targeting potential | High | Japan and APAC are especially relevant, with broader global research outreach also viable. |
| Best outreach approach | High | Use technical value messaging, research collaboration hooks, application notes, demo offers, and publication-aligned credibility. |
| Overall lead quality | High | Strong fit for high-value niche B2B and research-tech outreach; weaker for broad transactional list sales without deeper participant data. |
| Best use case | High | Account-based targeting, speaker/author outreach, academic partnership development, and engineering solution prospecting. |
| Limitations / risks | Medium | Public current-year attendee and headcount transparency is limited; event is conference-led, not a large exhibitor-heavy sourcing expo. |
Suitability for B2B attendee list building: Moderate. Best used for precision prospecting around named organizers, hosts, research institutions, speakers/authors, and aligned industry stakeholders rather than expecting a large public buyer directory.
Apollo.io Targeting Recommendation
| Filter Type | Recommended Filters | Purpose |
|---|---|---|
| Apollo industries | Higher Education; Research; Telecommunications; Semiconductors; Electrical/Electronic Manufacturing; Computer Hardware; Computer Software; Information Technology & Services; Industrial Automation; Government Administration | Build a high-fit technical and institutional target universe |
| Departments | Engineering; Research; Information Technology; Operations; Procurement; Business Development; Education | Capture both technical evaluators and purchasing influencers |
| Seniority | C-Level; VP; Director; Head; Manager; Owner of lab/program where relevant | Prioritize stakeholders with budget, roadmap, or vendor influence |
| Job titles | Professor, Principal Investigator, Research Director, R&D Manager, Engineering Director, Technical Director, Lab Director, Procurement Manager, CTO, Program Manager, Partnerships Director | Align outreach with conference-relevant decision makers and influencers |
| Geography | Japan; China; South Korea; Taiwan; Singapore; United States; Germany; United Kingdom | Focus on likely APAC concentration while retaining global research coverage |
| Employee size | 51–200; 201–500; 501–1,000; 1,001–5,000; 5,001+ | Covers universities, research institutes, and mid-to-large technical firms |
| Keywords | communications, circuits, systems, signal processing, 5G, 6G, IoT, edge computing, integrated circuits, AI chips, embedded systems, RF, semiconductor design | Improve precision within broad technical industry lists |
| Technologies | Use if relevant to offer: EDA tools, simulation platforms, cloud research platforms, semiconductor design stacks | Refine targets where solution category is known |
| Revenue range | Optional for corporate targets only; not essential for universities | Useful when segmenting enterprise R&D accounts from academic institutions |
| Company type | Public companies; private companies; educational institutions; nonprofit research entities | Support mixed academic and industry prospecting |
| Funding / public company filters | Optional for corporate innovation targeting | Useful if prioritizing well-funded or listed technology buyers |
Suggested Apollo Search Logic: Target contacts in Higher Education, Research, Telecommunications, Semiconductors, and Electrical/Electronic Manufacturing using title filters such as “Professor” OR “Principal Investigator” OR “R&D Manager” OR “Engineering Director” OR “Technical Director” OR “Lab Director” OR “Procurement Manager” AND keyword filters such as “5G” OR “6G” OR “communications” OR “circuits” OR “systems” OR “integrated circuits” OR “IoT” OR “edge computing” OR “AI chips”.
Client Fit Review Required
Please share the client website or product/service details. I will review the client offering and identify the highest-fit buyer companies, Apollo industries, seniority levels, departments, and job titles from this event.
Sources & Verification Notes
| Source | Type | What It Verified | Reliability |
|---|---|---|---|
| ICCCAS 2026 Official Conference Website | Official event website | Conference title, dates, Takasaki/Japan location, conference scope, co-sponsors, hosts, technical co-sponsor, publication/indexing claims, critical dates | High |
| User-supplied event details | Provided event input | Venue: G MESSE GUNMA; city: Takasaki; region: Gunma; country: Japan; start/end dates | Medium |
| IEEE | Official organization website | Organizational identity for named co-sponsor | High |
| Gunma University | Official institution website | Institutional identity for confirmed host | High |
| Xiamen University | Official institution website | Institutional identity for confirmed host | High |
| University of Electronic Science and Technology of China | Official institution website | Institutional identity for confirmed co-sponsor and conference founder reference | High |
| Wuhan University of Technology | Official institution website | Institutional identity for confirmed co-sponsor | High |
🎯 Selling to this event's audience? Get a free tailored buyer list
Tell us your work email and our AI instantly builds a buyer list matched to 2026 15th International Conference on Communications, Circuits, and Systems (ICCCAS 2026) — the best‑fit companies to target, the exact decision‑maker job titles, and the industry filters that fit what you sell.
🔒 Get my buyer details Free · ~20 seconds