
2026 13th International Conference on Soft Computing & Machine Intelligence (ISCMI 2026)
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About this event
13th International Conference on Soft Computing & Machine Intelligence (ISCMI 2026)
Date: November 18–20, 2026 | Location: Vienna, Austria
Organized by India International Congress on Computational Intelligence (IICCI)
Technically Co-sponsored by IEEE Austria Section
About ISCMI 2026
The 13th International Conference on Soft Computing & Machine Intelligence (ISCMI 2026) is the annual flagship event of the India International Congress on Computational Intelligence (IICCI). This conference brings together researchers, scientists, and industry professionals to present cutting-edge research and advancements in soft computing and machine intelligence.
ISCMI has achieved the milestone of hosting events across all six inhabited continents, making it a globally recognized platform for academic and industrial collaboration.
Objectives
- Publish latest research in soft computing and machine intelligence.
- Facilitate face-to-face exchange of ideas among delegates.
- Establish research or business collaborations and identify global partnership opportunities.
- Contribute to advancements in evolving scientific fields through conference outcomes.
Publications & Indexing
Accepted papers will be published in the ISCMI 2026 Conference Proceedings and submitted for indexing in:
- Ei Compendex
- Scopus
Special Journal Issue: Selected papers (with at least 30% extension) will be recommended to the Enterprise Information Systems (EIS) journal, which is indexed in:
- Web of Science
- Scopus
- Science Citation Index Expanded
- Others (CABS, CiteScore Q1, etc.)
Note: All ISCMI proceedings from 2014–2025 have been indexed in IEEE Xplore, Ei Compendex, and Scopus.
Key Features
- Plenary & Keynote Sessions: Featuring renowned experts in computational intelligence.
- 2026 10th IICCI Prof. Lotfi Zadeh Memorial Lecture: Honoring the legacy of the father of fuzzy logic.
- Invited Speakers: Leading researchers and industry leaders.
- Global Participation: Academics, researchers, and professionals from around the world.
Call for Papers
Papers are invited on all topics related to soft computing and machine intelligence, including but not limited to:
- Fuzzy logic and systems
- Neural networks and deep learning
- Evolutionary computation
- Machine learning algorithms
- Intelligent robotics and automation
- Big data analytics and AI applications
Submission Deadline: July 20, 2026
Submission Guidelines
To publish in the conference proceedings and present orally:
- Submit the full paper (PDF only) via the Electronic Submission System.
To present only (no publication):
- Submit an abstract via the same system.
Contact: iscmi@outlook.com for inquiries.
Contact Information
Email: iscmi@outlook.com
Official Website: https://www.iscmi.us/
Data sheet
| Event Overview | |
|---|---|
| Event Name | 2026 13th International Conference on Soft Computing & Machine Intelligence (ISCMI 2026) |
| Event Date | November 18–20, 2026 |
| Event Status | Upcoming |
| Venue | Vienna, Austria (specific venue not publicly confirmed on the official website excerpt) |
| City | Vienna |
| State / Region | Vienna (federal city / state), Austria |
| Country | Austria |
| Organizer | India International Congress on Computational Intelligence (IICCI) |
| Official Event Website | iscmi.us |
| Event Type | Academic / research conference with industry participation and publication focus |
| Primary Category | Science & Research |
| Secondary Applicable Categories | IT & Technology; Industrial Engineering; Education & Training |
| Audience Reach | Global academic and applied research audience |
| Estimated Attendance / Expected Footfall | Attendance figure not publicly confirmed by the organizer. |
| Attendance Data Reliability | Low to Medium; current-year attendance figure not published in the official excerpt provided |
| Main Purpose of Event | To present current research in soft computing and machine intelligence, enable face-to-face exchange, and create academic and industry collaboration opportunities. |
| About the Event |
|---|
|
ISCMI 2026 is the 13th edition of an international conference dedicated to soft computing and machine intelligence. The official website describes it as the annual flagship event of IICCI, with a program built around research presentation, publication, and cross-border collaboration. The conference is scheduled for Vienna, Austria, and is technically co-sponsored by the IEEE Austria Section.
The event matters because it sits at the intersection of academic research, applied AI, and technical publishing. It attracts researchers, scientists, authors, and potentially industry practitioners seeking visibility, collaboration, and access to emerging machine intelligence methods. For B2B prospecting, it is most relevant to organizations selling research tools, AI software, computing infrastructure, academic solutions, innovation services, and technology partnerships into universities, labs, and advanced engineering teams. |
| 1. Who Attends: Buyers / Attendees | |||
|---|---|---|---|
| Buyer / Attendee Segment | Typical Organizations | Buying Role or Influence | Relevance to Exhibitors / Suppliers |
| Researchers / Principal Investigators | Universities, research institutes, AI labs | Influence on tool selection, grants, collaborations, and pilot projects | High for software, datasets, compute, and publication-related services |
| Department Heads / Deans | Universities and engineering faculties | Budget influence, partnership approval, strategic direction | Relevant for research partnerships, sponsorships, and academic technology adoption |
| AI / ML Engineers and Data Scientists | Technology companies, applied research teams, innovation units | Technical evaluation and specification influence | High for cloud, compute, MLOps, analytics, and model-development tools |
| Innovation / R&D Leaders | Corporate R&D units, applied science teams | Program and partnership decision-making | Relevant for proof-of-concept, consulting, and advanced AI deployment services |
| Students / Early Career Researchers | Universities and doctoral programs | Low direct purchasing power; high future pipeline value | Useful for lead capture, recruitment, training, and community-building |
| Industry Sponsors / Technical Partners | AI vendors, software firms, compute providers, engineering companies | Corporate sponsorship and partnership decision-making | High relevance for event marketing, demos, and brand positioning |
| Journal / Publication Stakeholders | Editors, publishing partners, academic societies | Influence over publication pathways and editorial collaborations | Relevant for academic publishing, indexing, and conference proceedings services |
| 2. Event Location and Attendee Geographic Origin | |||
|---|---|---|---|
| Geographic Area | Likely Attendee Origin | Buyer Concentration | Notes |
| Vienna | Local universities, institutes, tech teams | Medium | Host city provides a small but relevant concentration of academic and innovation stakeholders |
| Austria | National academic and research community | High | Strong domestic fit due to Vienna-based venue and IEEE Austria Section co-sponsorship |
| Central Europe | Germany, Czech Republic, Slovakia, Hungary, Switzerland | Medium to High | Accessible regional travel corridor for researchers and collaborating institutions |
| Europe | Universities, labs, technology firms | High | Conference topic is broadly relevant across European research ecosystems |
| Global | International authors, speakers, and collaborators | Medium | Official website states the event has reached all six inhabited continents, supporting global visibility |
| 3. Audience Reach | ||
|---|---|---|
| Reach Level | Assessment | Explanation |
| Global | Primary classification | The official site states ISCMI has covered all six inhabited continents, indicating broad international appeal. |
| 4. Sample Buyer Companies and Websites | |||||
|---|---|---|---|---|---|
| Buyer Company / Organization | Buyer Type | Why It Is Relevant | Website | Best Job Titles to Target | Evidence Level |
| Technische Universität Wien | University / research buyer | Relevant for AI, computing, engineering research collaboration and academic tooling | tuwien.at | Professor, Department Chair, Research Director, Lab Manager | Strong Market Fit, Attendance Not Confirmed |
| University of Vienna | University / research buyer | Potential academic audience for computational intelligence, data science, and publication services | univie.ac.at | Dean, Principal Investigator, Research Group Leader | Strong Market Fit, Attendance Not Confirmed |
| Austrian Institute of Technology | Applied research institute | Applied AI, automation, and scientific collaboration are aligned with conference themes | ait.ac.at | R&D Director, Innovation Lead, Research Manager | Strong Market Fit, Attendance Not Confirmed |
| Siemens | Industrial technology buyer | Industrial AI, automation, and machine intelligence use cases | siemens.com | Head of AI, CTO Office, Innovation Director | Strong Market Fit, Attendance Not Confirmed |
| Infineon Technologies | Semiconductor / R&D buyer | Advanced machine intelligence and research collaboration relevance | infineon.com | VP R&D, AI Lead, Research Scientist Manager | Strong Market Fit, Attendance Not Confirmed |
| AVL List GmbH | Engineering / mobility technology buyer | Computational intelligence applications in automotive engineering and simulation | avl.com | Engineering Director, Data Science Lead, R&D Manager | Strong Market Fit, Attendance Not Confirmed |
| IBM | Enterprise technology buyer / solutions provider | AI research, hybrid cloud, and enterprise machine learning relevance | ibm.com | AI Strategy Lead, Research Manager, Partner Manager | Strong Market Fit, Attendance Not Confirmed |
| Microsoft | Cloud / AI buyer | Cloud AI, research partnerships, and developer ecosystem alignment | microsoft.com | Director of AI, Product Manager, Research Program Manager | Strong Market Fit, Attendance Not Confirmed |
| NVIDIA | Compute / AI infrastructure buyer | High-performance computing and AI acceleration are core to the conference topic | nvidia.com | AI Platform Lead, HPC Manager, Technical Partnerships Director | Strong Market Fit, Attendance Not Confirmed |
| SAP | Enterprise software buyer | Machine intelligence for enterprise applications, analytics, and automation | sap.com | VP Innovation, AI Product Lead, Data Science Director | Strong Market Fit, Attendance Not Confirmed |
| Fraunhofer Society | Applied research organization | Deep fit for research exchange, applied computing, and publication pathways | fraunhofer.de | Institute Director, Research Fellow, Project Lead | Strong Market Fit, Attendance Not Confirmed |
| ETH Zürich | University / research buyer | High-value international research participant for computational intelligence topics | ethz.ch | Professor, Lab Director, Research Group Lead | Strong Market Fit, Attendance Not Confirmed |
| 5. Job Profiles, Industries and Event Type | ||||
|---|---|---|---|---|
| Priority | Job Title / Function | Department | Seniority Level | Why This Role Matters |
| 1 | Professor / Principal Investigator | Research / Academic | Senior | Owns research direction, funding, and publication decisions |
| 2 | Research Director / Lab Director | R&D / Research | Senior | Evaluates tools, partners, and technical collaborations |
| 3 | Dean / Department Chair | Academic Administration | Executive / Senior | Approves institutional partnerships and conference participation |
| 4 | AI / Machine Learning Engineer | Engineering / Data Science | Mid to Senior | Technical evaluator for software, frameworks, and compute solutions |
| 5 | Data Scientist / Applied Scientist | Analytics / Research | Mid to Senior | Core audience for machine intelligence methods, tools, and datasets |
| 6 | Innovation Director / R&D Manager | Innovation / R&D | Senior | Looks for new technology adoption and partnership opportunities |
| 7 | Program Manager / Project Manager | Programs / Operations | Mid to Senior | Coordinates partnerships, pilots, and conference-related initiatives |
| 8 | Publisher / Journal Editor / Proceedings Manager | Publishing / Editorial | Senior | Important for publication, indexing, and special issue partnerships |
| 9 | Technical Partnerships Manager | Business Development / Alliances | Mid to Senior | Useful for sponsorship, ecosystem building, and vendor outreach |
| Apollo Industries | |||
|---|---|---|---|
| Priority | Apollo Industry | Why It Fits the Event | Best Buyer Use Case |
| 1 | Higher Education | Primary participant base is academic | Professors, labs, and department heads |
| 2 | Research | Research dissemination and collaboration focus | Principal investigators and research managers |
| 3 | Information Technology & Services | AI tooling, cloud, analytics, and software solutions | Technical buyers and innovation teams |
| 4 | Computer Software | Core AI and machine intelligence solutions market | Product leaders and solution architects |
| 5 | Computer Hardware | Compute infrastructure supports ML workloads | HPC and platform decision-makers |
| 6 | Semiconductors | AI acceleration and embedded intelligence relevance | R&D and product innovation teams |
| 7 | Electrical/Electronic Manufacturing | Applied automation and systems integration | Engineering and innovation leads |
| 8 | Automotive | Machine intelligence for simulation, autonomy, and controls | R&D and data science buyers |
| 9 | Management Consulting | Advisory firms support digital transformation and AI adoption | AI strategy and transformation partners |
| 10 | Publishing | Conference proceedings and special issues are publication-driven | Editorial and indexing partnerships |
| 6. Estimated Attendance | ||||
|---|---|---|---|---|
| Metric | Figure | Status | Source / Basis | Notes |
| Estimated total footfall | Not publicly confirmed | Confirmed unavailable | Official website excerpt provided | Organizer did not publish an attendance figure in the source text reviewed |
| Exhibitor count | Not publicly confirmed | Confirmed unavailable | Official website excerpt provided | Conference appears primarily academic rather than exhibition-led |
| Buyer count | Not publicly confirmed | Confirmed unavailable | Official website excerpt provided | Best viewed as a research and partnership audience, not a classic buyer expo |
| Speaker count | Not publicly confirmed | Confirmed unavailable | Official website excerpt provided | Speakers section exists, but the excerpt does not include a current list count |
| Historical attendance | Not publicly confirmed in the source excerpt | Confirmed unavailable | Official website excerpt provided | Use only with caution for forecasting and lead-volume planning |
| 7. Key Focus Areas and Buyer Engagement | |||
|---|---|---|---|
| Focus Area | Typical Buyer Need | Buyer Engagement Opportunity | Relevant Supplier Offering |
| Soft Computing | Methods and tools for optimization, uncertainty, and adaptive systems | Demo algorithms, applied research, and model validation | AI research software, simulation tools, analytics platforms |
| Machine Intelligence | Intelligent systems, machine learning, decision support | Technical sessions and solution conversations | ML tooling, data platforms, compute infrastructure |
| Academic Publishing | Visibility, indexing, and publication pathways | Special issue and proceedings promotion | Publishing services, journal partnerships, indexing support |
| Research Collaboration | Partner institutions, grants, and cross-border projects | Lead nurturing and partnership development | Research networks, consulting, program support |
| High-Performance Computing | Compute capacity for model training and experimentation | Infrastructure-led outreach to labs and innovation teams | Servers, GPUs, cloud compute, storage solutions |
| Lead Quality Assessment | ||
|---|---|---|
| Factor | Assessment | Explanation |
| Buyer relevance | High | Strong fit for research, AI, software, and academic solution vendors. |
| Decision-maker availability | Medium | Likely to include senior academics and technical leaders, though procurement-style buyers may be limited. |
| Data collection potential | Medium | Speaker, committee, and author data may be available, but confirmed attendee lists are not public in the excerpt. |
| Apollo targeting potential | High | Good fit for academic, research, software, hardware, and AI-focused targeting. |
| Geographic targeting potential | High | Vienna plus broader Austria, Europe, and international research communities are relevant. |
| Best outreach approach | Thought leadership + partnership outreach | Offer research collaboration, technical demo, publication, or sponsorship angles rather than hard-sell demand capture. |
| Overall lead quality | High | Strong event for niche B2B research and technical targeting. |
| Best use case | Research-led lead generation and partnership development | Best for vendors selling to universities, R&D teams, and AI innovation stakeholders. |
| Limitations / risks | Moderate | Not a buyer-heavy trade show; purchasing cycles may be longer and academically driven. |
| Apollo.io Targeting Recommendation | ||
|---|---|---|
| Filter Type | Recommended Filters | Purpose |
| Apollo industries | Higher Education, Research, Information Technology & Services, Computer Software, Computer Hardware, Semiconductors, Electrical/Electronic Manufacturing, Automotive, Management Consulting, Publishing | Align outreach with academic, research, and AI-adjacent buyers |
| Departments | Research, Engineering, Data Science, Innovation, IT, Partnerships, Academic Affairs | Reach technical evaluators and research decision-makers |
| Seniority | Manager, Director, VP, Head, C-Level, Professor, Principal Investigator | Prioritize decision-makers and technical approvers |
| Job titles | Professor, PI, Research Director, Lab Director, AI Director, Data Scientist, ML Engineer, Innovation Director, Program Manager, CTO, CIO | Match likely attendee profiles and buyer influencers |
| Geography | Austria, Germany, Switzerland, Central Europe, Europe, Global | Reflect host city and expected international participation |
| Employee size | 1–10, 11–50, 51–200, 201–1,000, 1,001–5,000, 5,001+ | Covers labs, startups, mid-market tech firms, and large enterprises |
| Keywords | soft computing, machine intelligence, AI, machine learning, data science, research, computational intelligence, optimization, neural networks, academic publishing | Narrow searches to event-relevant buyers and collaborators |
| Company type | Educational institution, research institute, enterprise technology company, R&D lab, publisher | Separate academic demand from commercial solution buyers |
| Revenue / funding | Use selectively for enterprise vendors; prioritize known research and innovation organizations first | Avoid over-filtering academic and public-sector targets |
| Client Fit Review Required |
|---|
| Please share the client website or product/service details. I will review the client offering and identify the highest-fit buyer companies, Apollo industries, seniority levels, departments, and job titles from this event. |
| Sources & Verification Notes | |||
|---|---|---|---|
| Source | Type | What It Verified | Reliability |
| ISCMI 2026 Official Website | Official organizer website | Event name, dates, city, country, organizer, co-sponsor, conference purpose, publication notes, and global positioning | High |
| ISCMI 2026 Publication & About Sections | Official event pages | Research focus, face-to-face collaboration objective, indexing intent, and proceedings positioning | High |
| ISCMI 2026 Speakers / Venue / Schedule Navigation | Official site navigation | Confirmed existence of speakers, venue, schedule, and attendee-related event pages | Medium to High |
| IEEE Austria Section | Co-sponsor reference source | Context for technical co-sponsorship and regional relevance | High |
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Tell us your work email and our AI instantly builds a buyer list matched to 2026 13th International Conference on Soft Computing & Machine Intelligence (ISCMI 2026) — the best‑fit companies to target, the exact decision‑maker job titles, and the industry filters that fit what you sell.